|
This white paper examines the market opportunities for channel bonding technology and the threat from fiber-based networks and protocol details of the channel bonding process, as well as describing the architecture of a DSLAM card with bonding. It closes with a listing of why FPGAs, such as Altera® Cyclone® III devices, are the optimum choice for implementing this type of application.
|
||||||
|
||||||
|
||||||
