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Title : Lead-free assembly shifts test methods toward boundary scan
Company : ASSET InterTech, Inc.
Date : 05-Nov-2007
Downloads : 5

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Featured Paper by Dr. Ben Bennetts

The toxic and harmful effects of lead on the environment have been well documented. As a result, several regions are attempting to eliminate lead-based solder entirely from electronics manufacturing. The European Community (EC) started the trend in the late 1990s with its Waste Electrical and Electronic Equipment (WEEE) and Restrictions of Hazardous Substances (RoHS) initiatives. WEEE dictates that lead solder will be banned from all electronic consumer products sold in Europe by July 1, 2006.
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