Posts Tagged ‘SNUG’
Thursday, December 15th, 2016
The New Year promises to be a dramatic one on many fronts, not the least being the ever-quickening pace of change in technology. Evidenced by the continued and enthusiastic attendance at conferences around the world, there are clearly so many opportunities to network, learn, and develop sales leads at these events. Bets are on that you’ll be attending at least one of these. Happy New Year!
* CES2017: Consumer Electronics Show – January 5-8 – Las Vegas
No one need tell you what CES encompasses: Here in its 50th annual edition, it will include everything. The 2017 keynotes will include addresses from the CEOs of Qualcomm, Huawai, Nissan Motors, and Nvidia. But the topics covered in this massive 100,000-attendee show will cover cars, wearables, healthcare devices, and every conceivable type of consumer clutter.
Thursday, August 11th, 2016
It takes courage to re-launch an existing product rather than start from scratch, to announce a refreshed and updated offering as if it were something brand new. That’s certainly the case with Synopsys‘ recent release of TetraMAX II. It took courage to build on a franchise that first arrived on the scene not just in the last century, but in the last millennium.
And it was with this sentiment that Synopsys’ Robert Ruiz and I started a recent phone call to discuss the July news that TetraMAX II has arrived on the scene.
Ruiz began: “This is TetraMax II. We wrote the key engines from scratch, an effort that took the R&D team a full two years to complete. The goal was to get 10x faster and 25-percent fewer patterns.”
Thursday, August 28th, 2014
With the advent of September, the fall conference season begins. Here are some upcoming meetings you may want to attend.
* DesignCon China – September 2-5 – Shenzhen
Last year close to 13,000 attended ICC-China. Expect even more to attend this year.
* Mentor Graphics Forum – September 3 & 5 – Shanghai & Beijing
Keynote will be given by Mentor CEO Dr. Wally Rhines, followed by President of ARM Greater China Allen Wu talking about the next 10 billion chips to be manufactured in China.
* IDF14: Intel Developers Forum – September 9-11 – San Francisco
Intel CEO Brain Krzanich will give opening keynote, followed by lots of talk about the IoT.
* PCB West 2014 – September 9-11 – Santa Clara
The most important conference of the year for board designers.
* Mentor U2U Automotive – September 10 – Dearborn
The debut of a new Mentor User2User event focusing on one of Mentor’s favorite core competencies.
Thursday, March 28th, 2013
To say this is the year of the finFET is somewhat of an understatement, because everywhere you go somebody’s talking about going up instead of out – at ISSCC, at DesignCon, at DVCon, at ISQED, at SNUG, at EDPS, at DAC.
Among the talks so far, one of the best was given by the father of the finFET himself, U.C. Berkeley’s Chenming Hu. If you were at ISQED in Santa Clara on March 5th, you heard Prof. Hu describe how increasing leakage current in planar devices motivated radical new thinking in the late 1990s: Instead of a classic source, drain, gate structure, take a thin film of high-quality silicon material, place gate-dielectric above and below it such that the silicon is never very far from the gate, and then turn the thing 90 degrees so that the source is out the back, the drain’s in front, and the gate material is vertical.
Thursday, December 6th, 2012
Shakeel Jeeawoody is VP of marketing at Blue Pearl. I enjoyed a long conversation with Shakeel at SAME Forum in France in October, and again at ARM TechCon in November. We completed the discussion by phone this week, starting with a brief profile of Blue Pearl and a discussion of FPGA versus ASIC design needs.
Per Jeeawoody, “Blue Pearl has been around since 2005, we’re located in Santa Clara, and our technology has all been developed in-house. Our underlying technology improves RTL analysis using symbolic simulation techniques and adapting them to our customers’ market requirements. We have competitors in the linting and clock-domain crossing [CDC] space, but not many that can generate SDC constraints and offer easy-to-use tools that run on Windows at an attractive price point to support FPGA designers.
“More FPGA designers today struggle with IP integration in their projects in the same way ASIC designers have in the past; if they don’t do the right level of analysis, there are reliability problems in the field. With that in mind, we focus on addressing emerging and major FPGA design issues – one we call Grey Cell Methodology, and we offer mode-based analysis to address issues associated with longest path analysis.