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Posts Tagged ‘Power & Thermal Constraints’

DAC 2013: carpe diem with Ten in Texas

Thursday, May 16th, 2013

 

Let’s be honest. If you haven’t booked your flight and hotel yet for the Design Automation Conference in Austin in the first week of June, you’ve probably decided you’re not going. If that’s the case, more’s the pity because the sessions alone are going to be great, above and beyond the parties and networking, and will make the trip totally worthwhile. Here’s a sampling of the some of the topics that will be among the most compelling, with an acknowledgment that not everybody’s interests are the same.

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DownStream: Solutions for Post Processing PCB Designs
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