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Posts Tagged ‘3-D Architectures for Semiconductor Integration and Packaging’

December 10th to 14th: IEDM & 3-D Architectures

Thursday, November 29th, 2012


You’ve got a little over a week to clear your calendar to attend two very important conferences spanning the week of December 10th to the 14th. IEDM is happening in San Francisco from December 10th to 12th, and the 3-D Architectures for Semiconductor Integration and Packaging Conference is happening in Redwood City from December 12th to 14th.

These are two well-attended and carefully constructed conferences which many people attend to learn about the latest in device engineering and 3D-IC architectures, both key to the future of the semiconductor industry.

Clearly, December is a busy month. If you’re in Sales, you may be trying to maximize your numbers for the quarter, and the year, over the remaining weeks of 2012. If you’re in R&D, you may be trying to utilize budget dollars that come with ‘use it or lose it’ strings attached. If you’re in Field Support, your customers are stressed, short on time, and need your attention sooner, not later, so they can wrap up their projects before their holiday leave begins. And if you’re that customer, the Designer trying to meet a development schedule, you are really strapped for time.


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