Conferences: Paper submission deadlines approach

A number of conferences important to EDA and IP are coming up over the next 12 months and currently looking for content. If you have an industry-relevant topic you’d like to talk about, the organizers of some of these conferences need to hear from you soon. Various deadlines are looming, most over the next few weeks.

Meanwhile, it’s interesting to consider that one of the most thrill- for-your-buck conferences on the list is Black Hat USA 2016 and Synopsys’ co-located CodenomiCON, both promising to teach you everything you need to know or are allowed to know about cybersecurity. Synopsys’ involvement in Black Hat may validate a comment overheard recently: ‘Synopsys is no longer really an EDA company. They’ve become a software integrity company.’

Also interesting, DVCon in San Jose and Mobile World in Barcelona in 2017 are on the exact same days. Perhaps there’s no overlap in the attendee population. But most interesting on the list, the sheer scale of the China International Modern Industry & Intelligent Equipment Exhibition with 500+ exhibitors, over 40,000 attendees, and more topics that you can possibly imagine.

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Upcoming conferences …

* Black Hat USA 2016 – 30 July to 4 August 2016 – Las Vegas
Synopsys will be hosting CodenomiCON on August 2nd.

* Flash Memory Summit – 9-11 August 2016 – Santa Clara
Obviously the program is already established, with many EDA companies participating.

* IEEE SFBA Nanotechnology Council – 16 August 2016 – Santa Clara
Topic: Extending Moore’s Law, the Promise of ultra-low-power Mechanical Computing

* Hot Chips – 21-23 August 2016 – Cupertino
An IEEE Symposium on high-performance chips, early reg til August 5th

* 2016 AWR Design Forum – August thru October – Asia, Europe, North America
An open forum for customers, partner and microwave/RF engineers

* Embedded Systems Conference – September, October, December – Minneapolis, Bangalore, San Jose
For embedded systems hardware, software, and firmware developers

* European Innovation Day – 12 September 2016 – Silicon Valley
Opening event for week-long Startup Europe comes to Silicon Valley

* ARC Processor Summit – 13 September 2016 – Santa Clara
Topics: embedded processor IP, software, programming tools and applications

* MIPI DevCon – 14-15 September 2016 – Mountain View
The inaugural event, early bird registration until August 19th

* 3DExperience Forum Eurocentral 2016 – 25-26 October 2016 – Berlin
Dassault Systems’ theme: How digital transformation is driving innovation

* SEMICON Europa 2016 – 25-27 October 2016 – Grenoble
The largest microelectronics event in Europe, it’s co-located with IoT Planet.

* ARM TechCon 2016 – 25-27 October 2016 – Santa Clara
Will this event eventually be renamed SoftBank TechCon?

* 2016 ICCAD – 7-10 November 2016 – Austin
The accepted papers have been announced.

* 2016 IEEE IEDM – 3-7 December 2016 – San Francisco
Admission Deadline is August 10th.

* IEEE Semiconductor Interface Specialists Conf – 7-10 December 2016 – San Diego
Deadline for submissions is August 8th.

* 3D ASIP – 13-15 December 2016 – San Francisco
This is the 13th Annual conference.

* DesignCon 2017 – 31 January to 2 February 2017 – Santa Clara
Deadline for paper submissions: August 16th

* IEEE ISSCC 2017 – 5-9 February 2017 – San Francisco
Deadline for paper submissions: September 12th

* DVCon U.S. 2017 – 27 February to 2 March, 2017 – San Jose
Submission site is open with earlier deadlines this time

* Mobile World Congress – 27 February to 2 March 2017 – Barcelona
Deadline for paper submissions is September 16th.

* ISQED – March 2017 – Santa Clara
Deadline for paper submissions is September 9th.

* DATE 2017 – 27-31 March 2017 – Lussaune
Deadline for paper submissions: TBD

* 54th Design Automation Conference – 18-22 June 2017 – Austin
Deadline for paper submissions: Usually late October

* 14th China International Modern Industry & Intelligent Equip Exhibition – 24-26 June 2017 – Shanghai
500+ exhibitors, 40,000+ attendees, 20+ countries, myriad industries, something for everyone.

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Tags: 3D ASIP, 3DExperience Forum, ARC Processor Summit, AWR Design Forum, Black Hat USA, DATE, Design Automation Conference, DVCon U.S., Embedded Systems Conference, European Innovation Day, Flash Memory Summit, Hot Chips, ICCAD, IEDM, IEEE Semiconductor Interface Specialists Conference, IEEE SFBA Nanotechnology Council, ISSCC, MIPI DevCon, Mobile World Congress

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