EDACafe Weekly Review August 4th, 2016

DVCon India Just Keeps Getting Better
August 3, 2016  by Tom Anderson, VP of Marketing

As many of you know, in 2014 the longstanding Design and Verification Conference and Exhibition (DVCon) expanded beyond Silicon Valley to India. The first year of DVCon India was very successful for a new event, drawing more than 450 attendees from more than 80 companies and universities. Last year’s show grew to more than 600 engineers attending the technical program, visiting the vendor exhibition, and enjoying the numerous opportunities to network with their peers.

The third annual DVCon India will be held on September 15 and 16, once again at the Leela Palace in Bangalore. From our perspective, the show just keeps getting better and better every year. The full program is now available online, and for today’s post we’d like to mention some of the technical sessions that we think look especially interesting. In a future post, we’ll discuss other aspects of the program, including the keynote addresses.

System Scaling is an Industry Movement
August 1, 2016  by Bob Smith, Executive Director

System Scaling Blog PostAnyone in our industry who doesn’t believe system scaling is an industry movement need look no further than the IoT market of high-volume and low-cost devices. While these devices have exacting densities, performance and power requirements, advanced process technologies are a bit too risky and costly for IoT developers. IoT also requires heterogeneous functions such as digital, analog, mixed-signal, sensors and MEMS, a challenging proposition to mix all of these capabilities on a single die/process.

And, system scaling –– or multi-die IC –– is a viable integration alternative to traditional transistor scaling of newer process technologies. It integrates complex systems at the functional/building block level, not the transistor level. It doesn’t replace the need for the SoC. Instead, the SoC remains a key functional component of the system or, in die-form, a key building block of a multi-die IC.  System scaling relies on different advanced packaging technologies used to integrate and package multiple heterogeneous die.



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