EDACafe Weekly Review October 18th, 2017

Zynq-based Embedded Development Kit for University Programs
October 17, 2017  by Farhad Fallahlalehzari

Creativity and innovation, which lead the society to success, rest on the foundational institutions such as schools and universities. They provide fertile soil to seed, grow and flourish enterprises. To harvest more within an industry, the ecosystem needs to be enriched where the seeds are grown. Considering that the university’s courses are the nutrition to student, they need to be designed in a productive manner as they will provide the next generation of engineers. By providing the necessary platform in addition to the rich and informative tutorials, the quality of the input information for students would be assured. Particularly in the field of Electrical and Computer Engineering, it is important that students get as much hands on experience as possible, and tackle design challenges – such as HW/SW co-design and co-verification – before entering the job market; for their own benefit as well as the industry as a whole.

In this blog, you will become familiar with the TySOM Education kit (TySOM EDU) package designed for the university courses related to hardware design and embedded system design researches.

The TySOM EDU contains a TySOM embedded development board, Riviera-PRO advanced hardware simulator and informative tutorials and reference designs. Although it is possible to choose any development board from the TySOM embedded development board family, the TySOM-1A-7Z010 would be the most cost-effective solution for most university projects.

TySOM-1A-7Z010 (ZynqTM) is a ready-to-use and feature-rich embedded development board which provides the required peripherals to tackle both basic and advanced Zynq-based projects. The XC7Z010 is based on the Xilinx® All Programmable System-on-Chip (SoC) architecture, which integrates a dual-core ARM Cortex-A9 processor with Xilinx 7-series Field Programmable Gate Array (FPGA) logic. Coupling the device to a rich set of peripherals for connectivity, communication and multimedia, makes this board ideal for university projects requiring HW/SW co-design.  For the rest of this article, visit the Aldec Design and Verification Blog.

In an open-source world, it’s all about integration
October 16, 2017  by Colin Walls

I have historically been somewhat skeptical about open source software (OSS). I am always wary of anything that is “free” and subscribe to the TANSTAAFL (“there ain’t no such thing as a free lunch”) principle. It has taken me quite a few years to understand that open software is not free – it is just a different business model from the usual “we make it, you buy it” approach.

I am only now coming to grips with how the OSS model really works, why it is a good thing and how business can leverage it to mutual benefit …

DVCon Europe 2017: Munich and So much more
October 12, 2017  by Peggy Aycinena

 


DVCon Europe 2017 will be in Munich next week
, a great destination for tourists and technologists alike. This is the fourth year the conference will occur in Europe, the original Silicon Valley based version now in its 27th year.

DVCon Europe General Chair Oliver Bell and I spoke this week by phone about the upcoming event; he was in Germany and I was in Northern California. I offered that Munich is a beautiful city, and he agreed.

“The conference will be in downtown Munich,” Bell said, “at the Holiday Inn. This is a really nice hotel, located near to Marienplaz, and easily reachable from public transportation.”

Bell then laughed and acknowledged that, as famous as the city’s Oktoberfest may be, it’s better that DVCon is being held several weeks after that particular annual exuberance has run its course. The city’s just that much more calm and enjoyable, he noted, after the hundreds of thousands of Oktoberfest revelers have returned to their normal pursuits.

CST: Webinar series
DownStream: Solutions for Post Processing PCB Designs


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