EDACafe Weekly Review February 24th, 2017

Portable Stimulus Takes Center Stage At DVCon 2017
February 23, 2017  by Maheen Hamid, co-founder at Breker Verification Systems, Inc

When DVCon opens next week, attendees will hear plenty of talk about Portable Stimulus, a methodology and technology that’s grabbing industry attention and gaining momentum with the design verification community. In fact, I predict it will be the buzz of the conference this year.

ESD Alliance Bulletin: DVCon, New Member Helic, Upcoming Events
February 23, 2017  by Bob Smith, Executive Director

I promised in my last post a special blog post with great photos highlighting the Phil Kaufman Award Ceremony and Dinner January 26. It will go up Monday.

But first, the news that the ESD Alliance will exhibit at DVCon at the DoubleTree Hotel in San Jose, Calif. We’ll be in Booth #100 in the foyer, so please stop by if you’re attending.

During DVCon, we’re co-hosting with OneSpin Solutions a panel, “Ride with the Verify Seven,” moderated by Jim Hogan of Vista Ventures featuring six verification leaders who grew their companies from startup to medium-sized industry player. It will be held Monday beginning at 7 p.m., after the Booth Crawl, until 8:30 p.m. Light refreshments and drinks will be served.

Panelists include:

  • Andy Stein, Vice President of North American Sales from Avery Design Systems
  • Adnan Hamid, CEO at Breker Verification Systems
  • Phil Moorby, Chief Architect of Montana, a Phil Kaufman Award recipient presented to him by the ESD Alliance and IEEE CEDA for inventing the Verilog language
  • Raik Brinkmann, President and CEO of OneSpin, an ESD Alliance Member Company
  • Prakash Narain, President and CEO at Real Intent, an ESD Alliance Member Company
  • Rick Carlson, ESD Alliance Member Company Verific’s Vice President of Sales and advisor to seven early-stage startups

The event is open free of charge to all Alliance member companies and DVCon attendees. Non-members of the Alliance or anyone without a DVCon badge are invited to attend for a fee of $40. Registration information and more details on the event can be found at: http://bit.ly/2kNWx6T

Helic Joins the Alliance

Helic, a leading supplier of EDA software for crosstalk analysis and signoff of high-frequency analog/RF and high-speed SoC design, is a new member of the Alliance. Helic joined for a variety of reasons, including networking activities such as the Phil Kaufman Award dinner, and emphasized the industry initiatives, such as Export, License Management and Interoperability, as important initiatives. It intends to be an active participant in all. Also noteworthy is the Market Statistics Service (MSS), a tool that will support Helic’s forecasting efforts.

Mark Your Calendars for Upcoming Alliance Events

More details will be forthcoming about “Energy Policy and Strategy for the IoT Era,” Thursday, March 23. A panel of experts will discuss how the California Energy Commission’s new rules and standards affect the semiconductor design ecosystem, including EDA, IP, embedded software and other technology vendors that supply products to PC system manufacturers.

Two weeks later, we’ll host the “CEO Outlook,” Thursday, April 6. It will feature members of the ESD Alliance Board: Simon Segars, CEO of ARM, Lip-Bu Tan, Cadence’s President and CEO, Wally Rhines, Chairman and CEO at Mentor, and Aart de Geus, Chairman and CEO of Synopsys. We’ll have more information soon.

Now is a good time to join the ESD Alliance! I’m available to answer any questions about the Alliance and why your company show join. Please contact me at bob@esd-alliance.org, or check out our website at: www.esd-alliance.org

DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IOTPLL


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