EDACafe Weekly Review May 1st, 2017

Celebrating Accellera’s UVM: Now it’s IEEE 1800.2
April 27, 2017  by Peggy Aycinena

 


Tom Alsop and the team at Accellera are elated
: The UVM standard has been accepted by the IEEE as 1800.2 and congratulations are certainly in order.

The effort has consumed upwards of 10 years, and represents thousands of man-hours of effort, consultation, compromise, consensus building, rinse and repeat. Over and over until the final product was polished, presented and approved by the IEEE. Not an easy process by anybody’s estimation.

When we spoke by phone this week about the Accellera announcement, I asked Tom Alsop [Principal Engineer at Intel] how difficult the whole thing had actually been.

He chuckled slightly: “For us, it was fairly difficult.”

Welcome CAST and SoC Solutions, New Members of the ESD Alliance
April 25, 2017  by Bob Smith, Executive Director

Please join me in welcoming two new members of the ESD Alliance –– CAST and SoC Solutions –– both of whom are semiconductor IP providers and intend to become active members of our SIP Working Group.

CAST of Woodcliff Lake, N.J., has 23 years of SIP experience and offers a range of production-proven SIP cores that include controllers and processors, compression, peripherals, interconnect and security, and encryption.

SoC Solutions from Suwanee, Ga., enables next-generation IoT and Machine to Machine (M2M) silicon devices by supplying processor-based IP and services to build innovative, low-power “connected” products.

According to Jim Bruister, SoC Solutions’ CEO: “The ESD Alliance is the all-important connection to the semiconductor design ecosystem. For a company like ours, there’s no better organization to belong to for both the networking opportunities and the Semiconductor IP Working Group that’s helping to define so many critical aspects of our market segment.”



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