Josefina Hobbs, Technical Solutions Architect for the Synopsys Eclypse Low Power Solution, defines the concept of a power domain and explains how to properly partition. She also offers guidance on the criteria for deciding whether, and how many, power domains should be used.
The worldwide need for smart, energy-efficient electronics has never been greater while engineering challenges continually expand. Solutions to these engineering challenges rely on accurate, predictive simulation software. The acquisition of Apache complements ANSYS’ software solutions by bringing together best-in-class products that drive ANSYS’ system vision for integrated circuits, electronic packages and printed circuit boards.
Aveek Sarkar from Apache and Larry Williams of ANSYS discuss product roadmaps and integration from both companies.
Steven McKinney from Mentor Graphics gave an update on the new HyperLynx Release 8.2 with thermal / power co-simulation analysis at DesignCon 2012.
Steven is a business development manager for Mentor Graphic’s Board System Division where he supports Mentor’s PCB analysis technologies which include tools for Signal Integrity, Power Integrity, Thermal and EMC design. Steven has previously held roles in technical marketing at Mentor Graphics, specializing in signal integrity and EMC analysis tools and educating the engineering community on signal integrity, power integrity, and EMC design issues. Prior to working for Mentor, Steven was a signal integrity engineer at Dell Computer developing server hardware. Steven received his BSEE and MSEE from North Carolina State University.
This presentation is by Benny Winefeld, Product Engineering Manager, Place and Route Division at Mentor Graphics. By using Calibre InRoute, the effects of metal fill insertion and CMP on routing and signal timing can be analyzed for a physical design from within the Olympus environment.
This presentation is by Benny Winefeld, Product Engineering Manager, Place and Route Division at Mentor Graphics. By using Calibre InRoute, sign-off lithography (LFD) analysis and automatic repair can be done for a physical design from within the Olympus environment.
DC Drop Analysis is a crucial step in any PCB design flow. Learn how utilizing DC Drop Analysis can greatly enhance your ability to identify potential power issues. Explore how co-simulating DC Drop and Thermal Analyses can optimize your entire power delivery network.