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Archive for the ‘PI – Power Integrity’ Category

DesignCon 2012: New HyperLynx Release 8.2 with Thermal / Power Co-simulation Analysis

Monday, February 13th, 2012

Steven McKinney from Mentor Graphics gave an update on the new HyperLynx Release 8.2 with thermal / power co-simulation analysis at DesignCon 2012.

Steven is a business development manager for Mentor Graphic’s Board System Division where he supports Mentor’s PCB analysis technologies which include tools for Signal Integrity, Power Integrity, Thermal and EMC design. Steven has previously held roles in technical marketing at Mentor Graphics, specializing in signal integrity and EMC analysis tools and educating the engineering community on signal integrity, power integrity, and EMC design issues. Prior to working for Mentor, Steven was a signal integrity engineer at Dell Computer developing server hardware. Steven received his BSEE and MSEE from North Carolina State University.

Tutorial: Better PCB Power Design with DC Drop Analysis

Monday, February 6th, 2012

DC Drop Analysis is a crucial step in any PCB design flow. Learn how utilizing DC Drop Analysis can greatly enhance your ability to identify potential power issues. Explore how co-simulating DC Drop and Thermal Analyses can optimize your entire power delivery network.

Presented by Steve McKinney of Mentor Graphics

 




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