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Daniel Payne
Daniel Payne
Daniel Payne, a freelance EDA consultant since 2004 has served: Blue Pearl Software, Lattice Semiconductor, ON Semiconductor, Physware, OptNgn Software, Barcelona Design, YXI and OASIS Tooling. He has marketed EDA tools for Mentor Graphics, Viewlogic, Opmaxx, CrossCheck and Silicon Compilers. His … More »

SPICE Circuit Simulation at DAC 2010

 
May 20th, 2010 by Daniel Payne

PAVILION PANEL
Hot and SPICEy: Users Review Different Flavors of SPICE and Fast SPICE

Topic Area: Analog/Mixed-Signal/RF Design

Tuesday, June 15, 2010
Time: 4:30 PM — 5:15 PM
Location: Booth #694
Summary:

dac-video-youtube

Are you one of the 20,000 analog and mixed-signal designers stuck waiting for your SPICE simulation run to complete today? Inexpensive multi-core hardware, multi-threaded software, and new algorithms promise to deliver SPICE accuracy 10- to 100-times faster than earlier methods. The panelists have evaluated the new generation of fast SPICE products and will discuss the trad-eoffs of each approach from a users’ perspective.

Click here to view Pavilion Panel videos.

Chair: Daniel Payne – Marketing EDA, Tualatin, OR
Organizer: Daniel Payne – Marketing EDA, Tualatin, OR
Speakers: Aaron Barker – Oracle, Broomfield, CO
Pierluigi Daglio – STMicroelectronics, Agrate, Italy
Jin-Qin Lu – Atheros Communications, Inc., Santa Clara, CA

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