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Posts Tagged ‘Internet of Things’

IoT: The Second Coming

Thursday, August 25th, 2016

 


This week’s blog post is authored by Bill Finch, Senior VP at CAST, Inc.
, long-time provider of IP cores and platform IP products. The discussion below maps the evolution of technologies and strategies that produced today’s IoT to the critical road map needed to achieve tomorrow’s.


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IoT: The Second Coming

The second wave of the IoT is about to start. In the first wave, there was little clarity about what functionality really mattered. Engineers were tasked with getting products out ASAP. Because of the uncertainty and rush, most first-wave products were built around off-the-shelf parts made by IDMs (Integrated Device Manufacturers). The emphasis was on getting things working, not on optimization.

This will not be true in the second wave.

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IoT: the A-to-Z of TechTalk at ARM TechCon

Thursday, October 2nd, 2014

 

This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.

By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”

Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.

** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”

** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and mbed.org, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.

** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”

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ARM: We are the champions of the world

Thursday, November 1st, 2012

 

You didn’t have to crank up Queen to hear the refrain in the background when ARM CEO Warren East stepped on stage in Silicon Valley this morning to deliver his keynote at the 2012 edition of ARM TechCon. No matter how you slice the pie, ARM is the champion of the world. They know it, they know that you and I know it, and we know that they know that we know it.

Yet despite all that knowing, the guys from ARM seem like a pretty likable bunch. A month ago, I heard ARM CTO Mike Muller give the keynote at the Sophia Antipolis Microelectronics Forum, where he left the same impression with his audience on the Cote d’Azure that Warren East left with his audience this morning in the heart of Silicon Valley: ARM puts cooperation above competition, partnering above posturing, and the well-being of the world above the well-being of the bottom line of ARM or the pocketbook any of its employees.

ARM may be the champion of the world, but it’s for a reason. They’re very good at what they do, they’ve had the luck and foresight to be in the right place at the right time over the last 2 decades, and they are as concerned as the rest of us about the plethora [read “billions”] of digital devices descending on the world which threaten to drive us all to the brink of destruction by way of global warming, polluted environs, or both.

Okay, that’s my qualitative take on this morning’s keynote. Following is a more quantitative version.

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