Posts Tagged ‘ARM’
Thursday, April 20th, 2017
There’s two kinds of conversations when it comes to electrical systems and cars. One is about the power train and the other one is about the advanced driver-assistance system, ADAS. Distinct as they may be, both of these systems can benefit from the optimizations associated with design automation, and both of these systems today are mashed up against the complexities of using third-party IP.
Chips in cars today need to manage the power train, or they need to provide safety and security for the driver – but either way, they need to work perfectly every time, all the time, and in some pretty hellish conditions. It’s hot under the hood and the road today is unforgiving. So are the lawyers.
So what’s a third-party IP provider supposed to do? Turn tail and run? Never sell into the automotive market where litigation looms larger than a sandstorm in April on the Texas Panhandle? Or try to man-up and work with the automotive market to provide IP that fits well into the chips that such customers need?
Thursday, April 13th, 2017
Something eerie and inexplicable happened on Thursday evening, April 6th. Out of nowhere, an intense storm swept through the Bay Area, unannounced and without warning. The skies darkened, the winds howled, severe rain pelted the crowded, suddenly dangerous freeways, and hundreds of thousands lost power.
Meanwhile, exactly in the midst of the most violent part of this mysterious storm, the CEOs of the four most important companies within the ESD Alliance sat on stools in front of an audience assembled at Synopsys and chatted about this, that, and the other. Seemingly oblivious to the profound violence unleashing itself just outside the windows, they acted as if nothing was amiss.
Everything in the industry – and the world – was in order: Wonderful, with the data pointing continuously up and to the right, and everywhere ample evidence for a bullish, optimistic, and excited outlook on the future of EDA and IP.
No matter that Nature was having its way out there in the darkness, that the U.S. had bombed Syria the hour before their discussion began, that the drumbeat for answers about entanglements with Russia was quickening, or difficult conversations with the President of the PRC were underway that very day in Florida – the CEOs of Synopsys, Cadence, Siemens/Mentor Graphics and SoftBank/ARM sat relaxed and easy, basking in the evident vitality of the EDA and IP industries, and allowing themselves to be shepherded through a congenial confab of confident chit-chat by Ed Sperling of Semiconductor Engineering fame.
That fact that the vagaries of Nature never came into the conversation was not surprising; the fact the Mr. Sperling refused all opportunities to bring what he termed as “politics” into the conversation was quite the opposite. Surprising, that is.
Thursday, February 9th, 2017
This week, the ESD Alliance announced that Sonics CEO Grant Pierce has been elected chair of the organization’s Board of Directors. His election is unique in several ways: Pierce is the first CEO of an IP company to lead the Alliance; he replaces two co-chairs, Cadence CEO Lip-Bu Tan and PDF Solutions, John Kibarian; and he is only the second CEO of a non-publicly traded company to serve as Board Chair, the other being Jasper CEO Kathryn Kranen who took the reins in 2012.
When Pierce and I spoke by phone on Tuesday about his election, he noted the unique circumstances of his new leadership role: “When I joined the board several years ago, it was with the intention to add a new point of view to what was then the EDA Consortium, to help the organization reflect the emerging reality of what was happening in the marketplace with respect to IP companies.
“In some ways, the IP companies consider themselves to be a necessary evil. Every chip developed today involves some sort of third-party IP, so having a place on the Board of the ESD Alliance is essential.”
Thursday, January 19th, 2017
At the ESD Alliance panel on the Cadence campus Wednesday night, it was Vista Ventures’ Jim Hogan who suggested the little open-source processor architecture called RISC-V will prove itself to be a plucky survivor when looming market realities hit 800-pound proprietary vendors like ARM and Intel. Hogan suggested RISC-V is positioned to survive that pending apocalypse just like “the mammals after the asteroid.”
Pretty dramatic stuff.
Hence it should not have been surprising, at the end of the 75-minute discussion on stage between Jim Hogan and Microsemi’s Ted Speers and SiFive’s Yunsup Lee, that I raised my hand and asked why Simon Segars was not in the room. After all, Simon Segars is both CEO of ARM and a key member of the Board of the Alliance that organized the Hogan-Speers-Lee program – a program where the emerging RISC-V movement was described as poised to upend the primacy of ARM etc.
Hogan responded to my question without answering: “Look, ARM is challenging by serving the low-cost processor market. License fees, royalty fees – that is what ARM wants for their low-power edge-based device. I think it was Simon, for example, who started talking to The Street about his economic strategy. It’s not really about what the best technology is, but about the economics. This is what gets the traction, and ARM will respond in an economic way.”
“Yes,” Ted Speers added, “and Intel and Imagination will also respond.”
Thursday, January 5th, 2017
One of your New Year’s Resolutions should be to further understand the philosophy, technology, and implications of the RISC-V movement. And there will be no better way to follow through on that resolution than to attend the upcoming ESD Alliance discussion on the topic.
In a nod to the best in situational irony, the Alliance is hosting an evening event in Silicon Valley on January 18th specifically to discuss this open source processor architecture, which per some has the potential to turn ARM’s market dominance on its ear.
Thursday, November 10th, 2016
Next Tuesday, November 15th, is the deadline for submitting research abstracts for the IP track at DAC 2017 in Austin in June. Paper manuscripts are due the following Tuesday. IP-themed session proposals are also due on that Tuesday, November 22nd, while Designer & IP Track proposals are due December 14th.
[NOTE: The December 14th date listed above is for invited Design Track & IP Track proposals. All other proposals for DAC 2017 Design Track & IP Track content can be submitted for review up until January 14, 2017. Thank you to DAC Press Chair Michelle Clancy for this important clarification.]
In other words, if you want to present within the IP Track at the 54th Design Automation Conference, you need to get going now.
The committee that will be overseeing review of these proposals is being headed up by Lattice Semiconductor’s Claude Moughanni – his group taking seriously their role in assembling an IP program that’s both informative and cutting edge.
Moughanni’s committee members include IPnest’s Eric Esteve, Synopsys’ Marc Greenberg, ARM’s Simon Rance, Freescale’s Henning Spruth, Mentor’s Farzad Zarrinfar, Intel’s Ty Garibay, Samsung’s Kelvin Low, Silvaco’s Warren Savage, and Cadence’s Karamveer Yadav – an impressive group who are indeed subject experts.
So, why should you go to all the effort to submit something for review by this group? Is there really any benefit in taking the time to participate at DAC, next year or ever?
Thursday, October 27th, 2016
Raise your hand if you think innovation comes out of small, nimble, edgy startups. Keep your hand up if you think consolidation is antithetical to the inventive culture closely associated with small, nimble edgy startups where everybody works outside of their job description and above their grade. Now put your hand down and tell us what you think about yet another merger in the semiconductor industry.
Yes, happy for investors that Qualcomm is buying NXP, but the end result will be a nasty one for technical innovators in EDA. Yet another reduction in the number of customers for EDA tools. Not necessarily a reduction in the number of seats, but a reduction in the number of actual separate corporate entities looking for tools for chip design.
Of course, for those who love large, lumbering organizations with almost as many people in the typing pool as in the engineering pool – more consolidation is great news for the semiconductor business and for the electronic design automation business, as well.
However, for those who still remember when EDA was a Wild West full of crazy startups, wacky business ideas, and loads of shifting sands between a constantly morphing/re-morphing population of EDA startups and an also-always morphing/re-morphing population of chip-design customers – take note: Those days are gone. Forever.
Thursday, October 13th, 2016
Next week, DVCon is once again in Europe, October 19-20 in Munich. A marvelous agenda has been laid out for this year’s 2-day conference, including three keynoters that pretty much sum up the state of things in the industry here in 2016. If you want to know where to apply your resources – both human and material – over the next decade, look no farther than these three talks.
It’s a tiring trip from Silicon Valley to Bavaria, but the quality of these presentations, combined with the rest of the content at DVCon Europe, will make the trip well worth the effort. Hope you’re going.
Thursday, September 22nd, 2016
Geoff Tate, founding CEO at Rambus, is busy – again. These days he’s leading the charge with a new FPGA-based enterprise that, per Tate, wants to be “the first to the party” – a party that’s all about providing FGPA-based IP to a market increasingly in need of these products.
When Tate and I spoke by phone recently, he offered the Flex Logix elevator pitch, and then focused on the company’s August press release.
“We are like the ARM of FPGA,” Tate said, and then laughed. “No, we are not expecting to be acquired by SoftBank anytime soon.”
“However, ARM was the first to successfully embed processors,” he said, “and at Flex Logic we are [doing that] with FPGAs.”
Thursday, August 25th, 2016
This week’s blog post is authored by Bill Finch, Senior VP at CAST, Inc., long-time provider of IP cores and platform IP products. The discussion below maps the evolution of technologies and strategies that produced today’s IoT to the critical road map needed to achieve tomorrow’s.
IoT: The Second Coming
The second wave of the IoT is about to start. In the first wave, there was little clarity about what functionality really mattered. Engineers were tasked with getting products out ASAP. Because of the uncertainty and rush, most first-wave products were built around off-the-shelf parts made by IDMs (Integrated Device Manufacturers). The emphasis was on getting things working, not on optimization.
This will not be true in the second wave.