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Peggy Aycinena
Peggy Aycinena
Peggy Aycinena is a freelance journalist and Editor of EDA Confidential at www.aycinena.com. She can be reached at peggy at aycinena dot com.

Vacation’s over: Autumn Conferences Ramp-up

 
August 12th, 2015 by Peggy Aycinena

Autumn used to start in September, but now classes and conferences commence in August and vacation ends just that much sooner. Here’s a list of various events you should consider attending between now and the end of the year, with thanks to conference organizers for the associated descriptions.

Scanning the range of topics, it’s clear the combined IP and EDA industries have an increasingly broad range of interests: IoT, autos, wearables, software security, verifying/integrating IP, power, device physics, memory, embedded processors and software, sensors, MEMS, a range of standards, networking, both the professional and technical kinds, and “synergistic collaborative design” both up in the cloud and down below on solid ground.

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* Intel Developer ForumAugust 18-20 – San Francisco

Intel’s premier conference is helping to shape the direction of tomorrow’s technology: visionary keynotes, technology and industry insights, and technical sessions. Relevant to EDA/IP, Synopsys will showcase its latest developments in DesignWare IP for USB and PCI Express in the SuperSpeed USB and General Communities.

* CDNLiveAugust 18-19 – Bengaluru

Brings together a record number of Cadence technology users, developers, and industry experts to network, share best practices on critical design and verification issues, learn ways to simplify design processes with IP, and discover new techniques for designing advanced silicon, SoCs, and systems. For the first time, the Jasper User’s Group conference will be merged with CDNLive India.

* Autonomous Cars 2015August 24-26 – Detroit

The path to autonomous cars is leading to accelerated deployment of high-performance processors and graphics systems, sensors, communications and software to deliver improved safety and security.

* Mentor Graphics Forum TaiwanAugust 25 – Hsinchu

Keynote will be given by Mentor CEO Rhines speaking about “Merger Mania”, followed by TSMC Sr. Director Suk Lee. Interestingly, corporate sponsors include ARM, Samsung, SMIC, TSMC, and GlobalFoundries.

* Mentor Graphics Forum ChinaAugust 27 – Shanghai

Keynote will be given by Mentor CEO Rhines speaking about “Merger Mania”

* Mentor Graphics Forum Korea – September 1 – Seoul

Keynote will be given by Mentor CEO Rhines speaking about “Merger Mania”

* CDNLiveSeptember 2 – Boston

CDNLive Boston brings together a record number of Cadence technology users, developers, and industry experts to network, share best practices on critical design and verification issues, learn ways to simplify design processes with IP, and discover new techniques for designing advanced silicon, SoCs, and systems.

* Wearable TechnologiesSeptember 10 – Toronto

WT is targeted at engineers, manufacturers, and start-ups, where attendees will create intelligent dialogue about innovative wearable solutions and the exhibitors will showcase their latest developments.

* DVCon IndiaSeptember 10-11 – Bangalore

Accellera sponsors DVCon India, a platform for sharing knowledge, experience and best practices covering ESL design & verification for IP and SOCs, VIP development and virtual prototyping for embedded software development and debug. Standards to be discussed include UVM, SystemC, SystemVerilog, PSL, assertions for AMS, Verilog, IP-XACT, OCP.

* ARC Processor Summit 2015September 15 – Santa Clara

The latest technologies and trends in embedded processor IP, software and programming tools, dual technical tracks with experts from Synopsys, ecosystem partners and the ARC user base will describe specific application domains, IoT, embedded vision, security, and embedded Linux. Synopsys CEO de Geus will keynote.

* TSMC 2015 Open Innovation Platform Ecosystem ForumSeptember 17 – Santa Clara

A one-of-a-kind event that brings together the semiconductor design chain community and approximately 1,000 director-level and above TSMC customer executives. The OIP Forum features a day-long, three-track technical conference along with an Ecosystem Pavilion with 80+ member companies. List of Forum Platinum Sponsors reads like the alpha companies of EDAC: ARM, Cadence, Mentor, Synopsys.

* Connect Security WorldSeptember 15-17 – Marseille Provence

Previously ‘Chip-to-Cloud Security Forum’, the conference provides an independent collaboration and information-sharing platform dedicated to strong security for today’s globally connected society. This 4th edition will welcome 300 IT security professionals around the latest, trusted technologies in Mobile, IoT and Cloud environments, implementation of trusted technologies in m-Payment, BYOD, Industry 4.0, wearables, connected cars. Synopsys CTO Borza will keynote.

* PCB West 2015September 15-17 – Santa Clara

Conference encompasses the entire PCB industry and brings together engineers, designers, fabricators, assemblers and managers to take advantage of unique opportunities to improve skills, increase knowledge and network with peers, colleagues and experts.

* Si2ConOctober 6 – Santa Clara

Get the details on the new Si2 Project Structure: Live demos, technical presentations, new collaboration tool for Si2 projects, and all-important networking reception.

* Wearable TechnologyOctober 12 – Hong Kong

If you are planning on attending HKTDC Hong Kong Electronics Fair, you should attend WT the day before to acquire professional insight into the WT ecosystem. Organizers are partnering with the all-knowing wearable certifiers, TÜV SÜD, to offer attendees a diverse conference filled with inspirational, educational talks, demos, and interactive activities.

* MemCon 2015October 13 – Santa Clara

The memory industry’s premier technical and ecosystem event showcases thought leaders driving advances in memory technology. Targeting decision makers and innovators in memory, systems integration, IP development, semiconductor design, and SoC development, MemCon offers insights into advanced technologies and standards and opportunities to network with leaders.

* ICCAD 2015November 2-6 – Austin

Formerly November’s anchor tenant in Silicon Valley, ICCAD 2015 is off to Texas as the premier forum to explore emerging challenges, present cutting-edge R&D solutions, record theoretical and empirical advances, and identify future road maps for design automation. Organizers command you to connect at ICCAD, and say this is your chance to catch up with old friends and make new connections in an eclectic city.

* ARM TechCon 2015November 10-12 – Santa Clara

Delivers an at-the-forefront comprehensive forum created to ignite the development and optimization of future ARM-based embedded products. By offering three full days of technical tracks, demonstrations, and industry insight from broad and deep levels of industry-leading companies and innovative start-ups, ARM TechCon remains more than a trade show; it is a comprehensive learning environment for the entire embedded community, uniting the software and hardware communities.

* DVCon EuropeNovember 11-12 – Munich

Accellera sponsors DVCon Europe again, after its successful launch last year. A technical conference focusing on design and verification of electronic systems and Cs, and brings chip architects, systems designers, software developers and IP integrators news on the latest methodologies, techniques, applications and demonstrations on the practical use of EDA and IP languages and standards.

* IEDM 2015December 7-9 – Washington, D.C.

IEEE International Electron Devices Meeting is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. The flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation. The conference scope not only encompasses devices in silicon, compound and organic semiconductors, but also in emerging material systems.

* 3D ASIPDecember 15-17 – Redwood City

3D Architectures for Semiconductor Integration and Packaging is the leading industry event in 3D integration and packaging. Perspectives on techno-market opportunities and challenges offered by building devices and systems in the vertical dimension. Targets senior-level technologists, managers, and executives as speakers and attendees, and serves needs of the entire 3D supply chain, from technology developers to equipment and materials suppliers to designers, manufacturers, and end users.


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