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Archive for October, 2014

USB 3.1: Synopsys still King of the Hill

Thursday, October 30th, 2014


This week Synopsys added even more fire-power to the arsenal that makes them one of the biggest IP vendors in the world. This time it’s USB 3.1, which the company says consists of a …

“DesignWare USB 3.1 Device Controller, an IP Virtual Development Kit and verification IP to accelerate the development of high-performance storage, digital office and mobile SoC applications. [The new product] supports 10 Gbps data transfer rates, power-down capabilities and compatibility with existing USB 3.0 software stacks and device protocols. Based on the DesignWare USB 3.0 Controller IP architecture, which has shipped in more than 100 million SoCs, the DesignWare USB 3.1 Device Controller IP enables designers to integrate USB 3.1 functionality with significantly less risk and faster time-to-market.”

As always, Synopsys delivers in a big way, which is why interviewing their people is always so much fun. These guys enjoy their work and know they’re on top, and not necessarily in that order. My phone call around the USB 3.1 announcement was with Eric Huang, Senior Product Marketing Manager for USB Digital IP at Synopsys, and was lively from start to finish.


IoT: the A-to-Z of TechTalk at ARM TechCon

Thursday, October 2nd, 2014


This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.

By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”

Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.

** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”

** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.

** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”


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