Anne Cirkel is the General Chair for the 52nd DAC and a Senior Director for Technology Marketing at Mentor Graphics. Prior to joining Mentor Anne held marketing management positions at Analogy, Viewlogic, and Berner & Mattner. Anne holds a Master's degree in Business Administration with an … More »
March 19th, 2015 by Anne Cirkel
Nose around the design automation industry a bit and you’re sure to find mention of the goal to “shift left.” Basically the idea is to try to solve problems and add value earlier in the design cycle. Engineers usually first stitch together basic functional blocks of whatever they are building before moving on to higher level system integration and software tasks. Turns out this isn’t a bad metaphor for conference planning. Like chips and ICs, conferences work best when the essential elements (in this case, marquee presenters and core technical content) are in place early. I can safely report this is more or less true now for DAC 52—which is slated to be simply amazing when it’s finally “launched” this summer.
DesignCon Panel On Next – Gen Engineering has our young engineers voicing their opinion on the future of engineering
March 4th, 2015 by Shachi Nandan Kakkar
DesignCon, held at the Santa Clara Convention Center, is one of the biggest annual conference on product technologies, design methodologies, and EDA software, with a focus on system-on-chip design.
February 11th, 2015 by Anne Cirkel
In tech it’s hard to avoid the conclusion that you’re either growing or dying, on the way up or on the way out. I poked modest fun at Apple in an earlier post, but their latest financial results certainly illustrate the point. By now you’ve probably heard that Apple’s $18 billion quarterly profit was the largest ever reported by a public company. At DAC, we may not be selling 34,000 iPhones per hour around the clock for three straight months (wow!), but we are setting our own records.
January 9th, 2015 by Anne Cirkel
Technical conferences change over time. Consider CES, wrapping up now in Las Vegas after generating the expected spate of headlines, mostly about wearables. (I have a Pebble so I can safely claim to be on the cutting edge, or at least the bandwagon.) For starters is the issue of the conference name. You won’t see many references to the “Consumer Electronics Show” on the official conference site this year. Consistent with tech’s global ambitions and love of acronyms, the official handle now seems to be “International CES,” though the media doesn’t seem to have caught onto this yet. More significant is how content at CES has evolved, even recently. As recently as 2011, the show reliably featured a slew of new Android phones. Now, most of the big announcements about smartphones — I think there is little argument these are still the hottest consumer devices on the planet — take place at Mobile World Congress in Barcelona.
December 10th, 2014 by Sanjay Gangal
What drives what happens now? A critical combination of the latest technology and knowledge, which is what you’ll find at IPC APEX EXPO 2015.
November 22nd, 2014 by Anne Cirkel
Thanksgiving is here so it’s likely to be a slow week in the EDA industry. Of course, like much else in our culture, this event has been co-opted by rampant media messages to shop and consume. Already I’ve seen lots of stories about Black Friday, mostly discussing whether the whole idea of a 24-hour window is now moot given Cyber Monday and the reality that the holiday shopping season now starts right after Halloween and stretches into January.
As a German I know I must tread lightly when writing about the most American of holidays. Turkey is not all that big on holiday menus back home and as I’ve written about in an earlier EDA Café post, football (or rather fussball) will always mean something different to me, no matter the success of the regional favorite Seahawks or my staff’s obsession with making their weekly fantasy picks. I’ll just say that I’ve grown to like some of the old-fashioned aspects of the holiday (a good meal with friends followed by a hike with the dogs, who demand to get out regardless of the weather). I can’t help but being thankful that EDA is not part of this annual shopping lunacy, at least not directly. Last I looked, the big three EDA vendors aren’t offering holiday-themed sales and I’ve never yet seen a line out the door for a piece of technical software. (That said, DAC attendees have been known to queue up for the free coffee, beer and wine that exhibitors offer almost every day — as I see it, much more reasonable behavior than waiting outside a superstore before it opens.)
November 4th, 2014 by Anand Shirahatti
Initially, USB provided two speeds (12 Mbps and 1.5 Mbps). With rapid adoption and success of the USB standard and the increasing power of PCs and computing devices, the USB 2.0 specification was defined in the year 2000. USB 2.0 provided upto 480 Mbps of bandwidth while keeping software compatibility with earlier USB applications. With ever increasing bandwidth requirements, in 2008 the USB 3.0 specification (providing 5 Gbps bi-directional bandwidth) was released. USB 3.1 is the next logical step in this progression. It provides 10Gbps of bi-directional bandwidth while maintaining backward compatibility with previous USB versions. To know more about USB 3.1 Verification solution click here.
In this post, we will analyze the technical differences between the USB 3.1 and USB 3.0 specifications. The aim is to enable people familiar with USB 3.0 to quickly understand the main aspects of USB 3.1.
We will analyze the PHY, Link and Protocol layers and list out the major ways in which USB 3.1 differs from USB 3.0.
October 27th, 2014 by Anne Cirkel
Okay, this is no hyperbole and I’m no longer just trying to gin up enthusiasm. The first batch of DAC deadlines is upon us. For those of you who won’t read beyond this paragraph, here are dates you need to know if you’re interested in participating in what remains the premier EDA industry conference. Proposals for the following are due November 13: panels, tutorials, workshops and co-located conferences. Abstracts for research papers are due November 21 and full manuscripts are due December 2; you can submit in these five categories: automotive electronic design, EDA research, ESS research, hardware software and security, and work-in-progress (WIP). I hope all those links help. Of course you can find more information and everything else you need on DAC.com.
October 27th, 2014 by Anand Shirahatti
Verification is never ending process! You can never be sure that you have verified everything. The aim of verification is risk reduction to the level of practical perfection.
The increase in chip complexity coupled with pressure to shorten time to market, are pushing chip design companies towards adoption of third party IPs. Let us consider you have weighed in all pros and cons of IP outsourcing and decided have to go for a third party IP for your next project. Then the question is – Does the externally bought IP need re-verification?
October 6th, 2014 by Anand Shirahatti
Many of you may have heard the story about the woodcutter and his blunt axe. The “Switching cost” of sharpening/buying a new axe may seem to be too high when in a time crunch. But a step back to review the situation and switching to a better tool can be life changing!
In today’s world this applies to chip design and verification teams more than ever. A Verification IP plays a key role in controlling verification schedules. Consider a case where tape out schedule is slipping in spite of having both – Internal VIP and External VIP.
Just like a blunt axe will take much longer to fell a tree, a sub standard Verification IP will prolong your IP Development. On the other hand if you “sharpen your axe” i.e. develop/buy a better Verification solution, it may initially seem like its taking longer and others are getting ahead. But, in the long run you will develop your IP faster.