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Intel to Acquire Barefoot Networks, Accelerating Delivery of Ethernet-Based Fabrics

 
June 11th, 2019 by intel

An Emerging Leader in Ethernet Switch Silicon for the Data Center, Barefoot Networks will Help Intel’s Data Center Group Meet the Rapidly-Changing Needs of Hyperscale Cloud Customers

Navin ShenoyBy Navin Shenoy

Intel's customers operate in a world that is growing and transforming by leaps and bounds. We've discussed previously the amazing fact that over half of the world's data was generated in the past two years and only 2% of that data has been analyzed. Driven by that reality, we're always asking ourselves how we can better enable our customers to harness the potential of this data, by moving, storing and processing it with the speed and efficiency that they demand.

An essential part of the equation is providing data center interconnects that can keep pace with our customers' extraordinary and growing requirements. This is why interconnect is one of our six technology pillars in which we are investing to serve our customers.

With this in mind, Intel has signed an agreement to acquire Barefoot Networks, an emerging leader in Ethernet switch silicon and software for use in the data center, specializing in the programmability and flexibility necessary to meet the performance and ever-changing needs of the hyperscale cloud. Upon close, the addition of Barefoot Networks will support our focus on end-to-end cloud networking and infrastructure leadership, and will allow Intel to continue to deliver on new workloads, experiences and capabilities for our data center customers.

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Interview with Ben Levine, Senior Director of Product Marketing at Rambus at headquarters..

 
May 13th, 2019 by Sanjay Gangal

Sanjay Gangal interviewed Ben Levine, Senior Director of Product Marketing at Rambus at headquarters.

Sanjay: Tell us about your presentation at the IP-SoC Conference.

Ben: My focus area is on security, in particular hardware security cores, the idea being that you want security embedded in really any chip to provide security to the rest of the chip in the system. So my talk today was talking about that, particularly for connected devices. The fact that everything is connected to the internet these days means that every device is now exposed to a wide range of threats and attackers. So you need really strong security. So I just talked about some of the challenges, particularly around not only devices being connected, but devices being complex, what the impact is on security, and how you can solve some of those problems with our hardware security core.

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Interview with John Mitchell, President and CEO of APEX/IPC 2019.

 
April 30th, 2019 by Sanjay Gangal

Sanjay Gangal interviewed John Mitchell, President and CEO of APEX/IPC 2019.

SG: How is IPC show been going?

JM:: IPC Apex Expo has been going great, we're very excited. Those exhibitors here have been having a great show, doing a lot of great business, selling product. The standards committee meetings have been going on since Saturday, will go for all the way through Saturday and then we have many different education programs going on in our professional development segment as well, and the attendance has been off the charts. It's been great.
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Intel Advances Hardware, Cloud and Connectivity at Open Compute Project Global Summit

 
March 14th, 2019 by intel

What’s New: At the Open Compute Project (OCP) Global Summit, Intel today announced new open hardware advancements enabling greater computing capabilities, innovation and cost efficiencies for data center hardware developers. The new advancements include a high-density, cloud-optimized reference design; collaboration with Facebook on the upcoming Intel Cooper Lake processor family; and optimization on Intel’s Rack Scale Design.

 Jason Waxman, Intel corporate vice president

Jason Waxman, Intel corporate vice president in the Data Center Group and general manager of the Datacenter Solutions Group, speaks Thursday, March 14, 2019, during a keynote address at the Open Compute Project Global Summit in San Jose, Calif. (Credit: Jurgen Project Productions)

“OCP is a vital organization that brings together a fast-growing community of innovators who are delivering greater choice, customization and flexibility to IT hardware. As a founding member of this open source community, Intel is committed to delivering innovative products that help deploy infrastructure underlying the services that support the digital economy.”
–Jason Waxman, Intel corporate vice president, general manager and data-centric chief strategy officer

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Intel Executive Leads Artificial Intelligence Researchers Linking AI to Quantum Physics Insight

 
March 13th, 2019 by intel

What’s New:A computer science research group from the Hebrew University of Jerusalem has mathematically proven that artificial intelligence (AI) can help us understand quantum physics phenomena. The results have been published in Physical Review Letters. Intel Senior Vice President and Mobileye CEO Prof. Amnon Shashua shared the group’s findings during a keynote Wednesday at the Science of Deep Learning Conference hosted by The National Academy of Sciences in Washington, D.C.

Intel

Intel Senior Vice President and Mobileye CEO Prof. Amnon Shashua speaks Wednesday, March 13, 2019, at the Science of Deep Learning Conference hosted by The National Academy of Sciences in Washington, D.C. A computer science research group led by Shashua from the Hebrew University of Jerusalem has mathematically proven that artificial intelligence can help us understand quantum physics phenomena. (Credit: Intel Corporation)

“Our research proves that the AI algorithms can represent highly complex quantum systems significantly more efficiently than existing approaches.”
–Prof. Amnon Shashua, Intel senior vice president and Mobileye president and CEO

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Software Simplicity: The Solution to Vision at the Edge

 
March 7th, 2019 by intel

Deploying vision capabilities on edge platforms requires difficult tradeoffs between latency, throughput, memory footprint, communication bandwidth, power, and cost. Luckily, there’s an ever-growing diversity of hardware choices to allow system designers to select the best option that meets their needs. Historically, hardware diversity also implied time-consuming software development to port vision applications and algorithms to a new hardware target and optimize for real-time constraints. Intel® is working with the industry to solve the puzzle of hardware diversity for traditional and deep learning-based vision at the edge.

The Intel® Distribution of OpenVINO™ toolkit (which stands for Open Visual Inference and Neural Network Optimization) enables developers to streamline the deployment of deep learning inference and high-performance computer vision applications across a wide range of vertical uses cases at the edge. The toolkit is compatible with popular open source deep learning frameworks, and enables developers to easily target execution on CPUs and accelerators (GPUs, FPGAs, VPUs, and so on) specially designed for AI inference, such as Intel® Vision Accelerator Design Products. The beauty of the toolkit is that it provides a unified and common abstraction layer for AI inference across diverse hardware targets, with a comprehensive and intuitive API that merges simplicity with optimized performance. Software simplicity and performance – just what the developer ordered!

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Intel Takes Steps to Enable Thunderbolt 3 Everywhere, Releases Protocol

 
March 4th, 2019 by intel

Intel ImageIn March 2019, Intel Corporation announced that it has contributed the Thunderbolt protocol specification to the USB Promoter Group. The USB Promoter Group also announced the pending release of the USB4 specification, based on the Thunderbolt protocol. The convergence of the underlying Thunderbolt and USB protocols will increase compatibility among USB Type-C connector-based products, simplifying how people connect their devices. (Credit: Tim Herman/Intel Corporation)

What’s New: Intel is well on its way to making the innovation delivered with Thunderbolt™ 3 available to everyone. Today, Intel announced that it contributed the Thunderbolt protocol specification to the USB Promoter Group, enabling other chipmakers to build Thunderbolt-compatible silicon, royalty-free. In addition, the USB Promoter Group announced the pending release of the USB4 specification, based on the Thunderbolt protocol. The convergence of the underlying Thunderbolt and USB protocols will increase compatibility among USB Type-C connector-based products, simplifying how people connect their devices.

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Another Attempt to Stifle Competition

 
December 20th, 2018 by intel

Qualcomm’s Patent Litigation Campaign isn’t Really about Vindicating Intellectual Property Rights

Steven RodgersBy Steven Rodgers

Competition authorities around the world have repeatedly found Qualcomm’s licensing practices unlawful, yet Qualcomm continues to try to achieve the same results through a campaign of patent lawsuits. These lawsuits have been largely unsuccessful, and at best would reduce innovation and raise prices.

Qualcomm’s goal is not to vindicate its intellectual property rights, but rather to drive competition out of the market for premium modem chips, and to defend a business model that ultimately harms consumers. As we’ve noted before, in the last several years, Qualcomm has been fined nearly a billion dollars in China, $850 million in Korea, $1.2 billion by the European Commission and $773 million in Taiwan (later reduced in a settlement) for anti-competitive practices.

More: Qualcomm’s Rhetoric Pierced

Meanwhile, the U.S. Federal Trade Commission continues to pursue claims against Qualcomm in federal court for alleged violation of U.S. antitrust law. Just last month, the Northern California federal district court rejected Qualcomm’s arguments that it has a legal basis for its refusal to license its standards-essential patents to modem chip competitors. Judge Lucy Koh rejected Qualcomm’s strained arguments that its conduct has a basis in the rules of its standards bodies participation. She concluded that, “Qualcomm never attempts to explain how discrimination against modem chip suppliers is consistent with the stated purposes of the IPR policies.”

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Intel Looks beyond CMOS to the Future of Logic Devices

 
December 3rd, 2018 by intel

What’s New: Today, “Nature” published a research paper on the next generation of logic devices authored by researchers from Intel, the University of California, Berkeley, and the Lawrence Berkeley National Laboratory. The paper describes a magneto-electric spin-orbit (MESO) logic device, invented by Intel. MESO devices have the potential to lower voltage by 5 times and energy by 10-30 times when combined with ultralow sleep state power, as compared to today’s complementary metal-oxide-semiconductors (CMOS). While Intel is pursuing CMOS scaling, the company has been working on computing logic options that will emerge in the next decade for the beyond-CMOS era, driving computing energy-efficiency and allowing performance to grow across diverse computing architectures

“We are looking for revolutionary, not evolutionary, approaches for computing in the beyond-CMOS era. MESO is built around low-voltage interconnects and low-voltage magneto-electrics. It brings together quantum materials innovation with computing. We are excited about the progress we have made and are looking forward to future demonstrations of reducing the switching voltage even further toward its potential.”
–Ian Young, Intel Senior Fellow and director of the Exploratory Integrated Circuits group in the Technology and Manufacturing Group

Why it Matters: Intel researchers invented the MESO device, with the memory, interconnect and logic requirements of future computing needs in mind. The MESO device was prototyped at Intel using quantum materials with emergent quantum behaviors at room temperature, with magneto-electric materials developed by Ramamoorthy Ramesh at UC Berkeley and the Lawrence Berkeley National Laboratory. MESO also utilizes spin-orbit transduction effects described by Albert Fert at Unité Mixte de Physique CNRS/Thales.

“MESO is a device built with room temperature quantum materials,” said Sasikanth Manipatruni, senior staff scientist and director of Intel Science and Technology Center on Functional Electronics Integration and Manufacturing. “It is an example of what is possible, and hopefully triggers innovation across industry, academia and the national labs. A number of critical materials and techniques are yet to be developed to allow the new type of computing devices and architectures.”

More Context: Magnetoelectric Spin-Orbit Logic with Non-volatility and Energy Efficiency (DOI) (Nature)

Intel Targets 5G Infrastructure with Latest Silicon Photonics Technology

 
September 24th, 2018 by intel

What’s New: Intel today announced details on the expansion of its portfolio of 100G silicon photonics transceivers beyond the data center and into the network edge. At the European Conference on Optical Communication (ECOC) in Rome, Intel unveiled specifics on new silicon photonics products that are optimized to accelerate the movement of massive amounts of data being generated by new 5G use cases and Internet of Things (IoT) applications. The latest 100G silicon photonics transceivers are optimized to meet the bandwidth requirements of next-generation communications infrastructure while withstanding harsh environmental conditions.

silicon photonics|

Intel Corporation’s portfolio of 100G silicon photonics transceivers are optimized to meet the bandwidth requirements of next-generation communications infrastructure while withstanding harsh environmental conditions. (Credit: Intel Corporation)

“Our hyperscale cloud customers are currently using Intel’s 100G silicon photonics transceivers to deliver high-performance data center infrastructure at scale. By extending this technology outside the data center and into 5G infrastructure at the edge of the network, we can provide the same benefits to communications service providers while supporting 5G fronthaul bandwidth needs.”
– Dr. Hong Hou, vice president and general manager of Intel’s Silicon Photonics Product Division

Why It’s Important: In the data-centric era, the ability to move, store and process data is paramount. Intel’s 100G silicon photonics solutions deliver tremendous value by offering fast, reliable and cost-effective connectivity. The industry’s move to 5G, along with a ramp in existing network traffic such as video streaming, is straining existing communications infrastructure that must support an expanded spectrum range including mmWaves, massive MIMO and network densification. Intel’s latest 100G silicon photonics transceivers meet the bandwidth demands of 5G wireless fronthaul applications. These transceivers are designed to meet the harsh outdoor conditions of cellular towers with the capability to support optical transport to the nearest baseband unit or central office (up to 10 km).

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