The Dominion of Design
March 14th, 2019 by intel
What’s New: At the Open Compute Project (OCP) Global Summit, Intel today announced new open hardware advancements enabling greater computing capabilities, innovation and cost efficiencies for data center hardware developers. The new advancements include a high-density, cloud-optimized reference design; collaboration with Facebook on the upcoming Intel Cooper Lake processor family; and optimization on Intel’s Rack Scale Design.
“OCP is a vital organization that brings together a fast-growing community of innovators who are delivering greater choice, customization and flexibility to IT hardware. As a founding member of this open source community, Intel is committed to delivering innovative products that help deploy infrastructure underlying the services that support the digital economy.”
March 13th, 2019 by intel
What’s New:A computer science research group from the Hebrew University of Jerusalem has mathematically proven that artificial intelligence (AI) can help us understand quantum physics phenomena. The results have been published in Physical Review Letters. Intel Senior Vice President and Mobileye CEO Prof. Amnon Shashua shared the group’s findings during a keynote Wednesday at the Science of Deep Learning Conference hosted by The National Academy of Sciences in Washington, D.C.
“Our research proves that the AI algorithms can represent highly complex quantum systems significantly more efficiently than existing approaches.”
March 7th, 2019 by intel
Deploying vision capabilities on edge platforms requires difficult tradeoffs between latency, throughput, memory footprint, communication bandwidth, power, and cost. Luckily, there’s an ever-growing diversity of hardware choices to allow system designers to select the best option that meets their needs. Historically, hardware diversity also implied time-consuming software development to port vision applications and algorithms to a new hardware target and optimize for real-time constraints. Intel® is working with the industry to solve the puzzle of hardware diversity for traditional and deep learning-based vision at the edge.
The Intel® Distribution of OpenVINO™ toolkit (which stands for Open Visual Inference and Neural Network Optimization) enables developers to streamline the deployment of deep learning inference and high-performance computer vision applications across a wide range of vertical uses cases at the edge. The toolkit is compatible with popular open source deep learning frameworks, and enables developers to easily target execution on CPUs and accelerators (GPUs, FPGAs, VPUs, and so on) specially designed for AI inference, such as Intel® Vision Accelerator Design Products. The beauty of the toolkit is that it provides a unified and common abstraction layer for AI inference across diverse hardware targets, with a comprehensive and intuitive API that merges simplicity with optimized performance. Software simplicity and performance – just what the developer ordered!
March 4th, 2019 by intel
In March 2019, Intel Corporation announced that it has contributed the Thunderbolt protocol specification to the USB Promoter Group. The USB Promoter Group also announced the pending release of the USB4 specification, based on the Thunderbolt protocol. The convergence of the underlying Thunderbolt and USB protocols will increase compatibility among USB Type-C connector-based products, simplifying how people connect their devices. (Credit: Tim Herman/Intel Corporation)
What’s New: Intel is well on its way to making the innovation delivered with Thunderbolt™ 3 available to everyone. Today, Intel announced that it contributed the Thunderbolt protocol specification to the USB Promoter Group, enabling other chipmakers to build Thunderbolt-compatible silicon, royalty-free. In addition, the USB Promoter Group announced the pending release of the USB4 specification, based on the Thunderbolt protocol. The convergence of the underlying Thunderbolt and USB protocols will increase compatibility among USB Type-C connector-based products, simplifying how people connect their devices.
December 20th, 2018 by intel
Qualcomm’s Patent Litigation Campaign isn’t Really about Vindicating Intellectual Property Rights
By Steven Rodgers
Competition authorities around the world have repeatedly found Qualcomm’s licensing practices unlawful, yet Qualcomm continues to try to achieve the same results through a campaign of patent lawsuits. These lawsuits have been largely unsuccessful, and at best would reduce innovation and raise prices.
Qualcomm’s goal is not to vindicate its intellectual property rights, but rather to drive competition out of the market for premium modem chips, and to defend a business model that ultimately harms consumers. As we’ve noted before, in the last several years, Qualcomm has been fined nearly a billion dollars in China, $850 million in Korea, $1.2 billion by the European Commission and $773 million in Taiwan (later reduced in a settlement) for anti-competitive practices.
Meanwhile, the U.S. Federal Trade Commission continues to pursue claims against Qualcomm in federal court for alleged violation of U.S. antitrust law. Just last month, the Northern California federal district court rejected Qualcomm’s arguments that it has a legal basis for its refusal to license its standards-essential patents to modem chip competitors. Judge Lucy Koh rejected Qualcomm’s strained arguments that its conduct has a basis in the rules of its standards bodies participation. She concluded that, “Qualcomm never attempts to explain how discrimination against modem chip suppliers is consistent with the stated purposes of the IPR policies.”
December 3rd, 2018 by intel
What’s New: Today, “Nature” published a research paper on the next generation of logic devices authored by researchers from Intel, the University of California, Berkeley, and the Lawrence Berkeley National Laboratory. The paper describes a magneto-electric spin-orbit (MESO) logic device, invented by Intel. MESO devices have the potential to lower voltage by 5 times and energy by 10-30 times when combined with ultralow sleep state power, as compared to today’s complementary metal-oxide-semiconductors (CMOS). While Intel is pursuing CMOS scaling, the company has been working on computing logic options that will emerge in the next decade for the beyond-CMOS era, driving computing energy-efficiency and allowing performance to grow across diverse computing architectures
“We are looking for revolutionary, not evolutionary, approaches for computing in the beyond-CMOS era. MESO is built around low-voltage interconnects and low-voltage magneto-electrics. It brings together quantum materials innovation with computing. We are excited about the progress we have made and are looking forward to future demonstrations of reducing the switching voltage even further toward its potential.”
Why it Matters: Intel researchers invented the MESO device, with the memory, interconnect and logic requirements of future computing needs in mind. The MESO device was prototyped at Intel using quantum materials with emergent quantum behaviors at room temperature, with magneto-electric materials developed by Ramamoorthy Ramesh at UC Berkeley and the Lawrence Berkeley National Laboratory. MESO also utilizes spin-orbit transduction effects described by Albert Fert at Unité Mixte de Physique CNRS/Thales.
“MESO is a device built with room temperature quantum materials,” said Sasikanth Manipatruni, senior staff scientist and director of Intel Science and Technology Center on Functional Electronics Integration and Manufacturing. “It is an example of what is possible, and hopefully triggers innovation across industry, academia and the national labs. A number of critical materials and techniques are yet to be developed to allow the new type of computing devices and architectures.”
More Context: Magnetoelectric Spin-Orbit Logic with Non-volatility and Energy Efficiency (DOI) (Nature)
September 24th, 2018 by intel
What’s New: Intel today announced details on the expansion of its portfolio of 100G silicon photonics transceivers beyond the data center and into the network edge. At the European Conference on Optical Communication (ECOC) in Rome, Intel unveiled specifics on new silicon photonics products that are optimized to accelerate the movement of massive amounts of data being generated by new 5G use cases and Internet of Things (IoT) applications. The latest 100G silicon photonics transceivers are optimized to meet the bandwidth requirements of next-generation communications infrastructure while withstanding harsh environmental conditions.
“Our hyperscale cloud customers are currently using Intel’s 100G silicon photonics transceivers to deliver high-performance data center infrastructure at scale. By extending this technology outside the data center and into 5G infrastructure at the edge of the network, we can provide the same benefits to communications service providers while supporting 5G fronthaul bandwidth needs.”
Why It’s Important: In the data-centric era, the ability to move, store and process data is paramount. Intel’s 100G silicon photonics solutions deliver tremendous value by offering fast, reliable and cost-effective connectivity. The industry’s move to 5G, along with a ramp in existing network traffic such as video streaming, is straining existing communications infrastructure that must support an expanded spectrum range including mmWaves, massive MIMO and network densification. Intel’s latest 100G silicon photonics transceivers meet the bandwidth demands of 5G wireless fronthaul applications. These transceivers are designed to meet the harsh outdoor conditions of cellular towers with the capability to support optical transport to the nearest baseband unit or central office (up to 10 km).
August 8th, 2018 by intel
Intel outlines vision for reimagining memory and storage with Optane + QLC. Intel is reimagining the memory-and-storage market and igniting a new era of computing with a combination of two unique memory technologies in memory and storage solutions no one in the industry currently offers: Intel® Optane™ and Intel® QLC 3D NAND.
“Intel Optane and 3D NAND technologies ensure computer and storage architects and developers can access vital data where and when they need it. The two technologies bridge the wide gap that exists between data that’s being worked on and data that’s waiting to be accessed.”
Why It’s Important: The combination of Intel Optane and Intel QLC 3D NAND technologies allows customers to accelerate the speed of their most frequently accessed data, while utilizing the value flash technology delivers over HDDs for massive capacity storage. Intel’s aim is to break bottlenecks and deliver better solutions to unleash the value of data.
How It’s Used: Optane has already had an impact throughout the world. Here are a few examples:
Intel’s QLC 3D NAND products announced today at Flash Memory Summit deliver new memory and storage solutions: Tencent, employing the new QLC PCIe Intel® SSD D5-P4320 in an initial production environment, increased by 10 times the number of customers served on a per-system basis.
July 23rd, 2018 by intel
What’s New: The Smithsonian American Art Museum* (SAAM) exhibition, “No Spectators: The Art of Burning Man,” is now available in virtual reality (VR) through Sansar*, the premier destination for social VR. Powered by Intel technology, this recently announced partnership will make iconic artwork more accessible and interactive through virtual reality.
“Intel empowers the creator to take their work to the next level. Technology has the potential to achieve new goals and ambitions for museums and galleries. Immersive technologies, like virtual reality, unlock new and exciting ways to experience art and exhibits. Fans can now check out “No Spectators” from their own home. Without Intel’s high-performance processors, these experiences would not be possible.”
July 16th, 2018 by intel
Intel’s partnership with the China Foundation for Cultural Heritage Conservation (CFCHC) to protect and preserve the Jiankou section of the Great Wall of China is underway. And experts from Wuhan University LIESMARS have been added to the project, leveraging Intel technologies to preserve the wall more efficiently and safely than before.
This is the next step in Intel’s recently announced commitment to inspect and preserve the Jiankou section of the Great Wall. By incorporating advanced technologies into this partnership, Intel is giving conservationists new tools to protect history and help preserve one of the great architectural wonders of the world.