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System Scaling is an Industry Movement

Monday, August 1st, 2016

System Scaling Blog PostAnyone in our industry who doesn’t believe system scaling is an industry movement need look no further than the IoT market of high-volume and low-cost devices. While these devices have exacting densities, performance and power requirements, advanced process technologies are a bit too risky and costly for IoT developers. IoT also requires heterogeneous functions such as digital, analog, mixed-signal, sensors and MEMS, a challenging proposition to mix all of these capabilities on a single die/process.

And, system scaling –– or multi-die IC –– is a viable integration alternative to traditional transistor scaling of newer process technologies. It integrates complex systems at the functional/building block level, not the transistor level. It doesn’t replace the need for the SoC. Instead, the SoC remains a key functional component of the system or, in die-form, a key building block of a multi-die IC.  System scaling relies on different advanced packaging technologies used to integrate and package multiple heterogeneous die.

Visit the Electronic System Design (ESD) Alliance at SEMICON West

Monday, July 11th, 2016

If you are planning to attend SEMICON West, please put the ESD Alliance booth on your Must See list so you can learn more about us. We will be in booth N1 in the North Hall at the Moscone Center in San Francisco. Exhibit hours are Tuesday, July 12, and Wednesday, July 13, from 10 a.m. until 5 p.m., and Thursday, July 14, from 10 a.m. until 4 p.m.


During SEMICON West, I will be a panelist on “The Path to Semiconductor and MEMS/Sensors Common Best Practices for Growth” discussion Wednesday from 2 p.m. until 3 p.m. It’s part of a workshop organized by SEMI and the MEMS & Sensors Industry Group titled, “From Collision to Convergence: Co-Creating Solutions in the Semiconductor and MEMS/Sensors Industries.” The workshop will run from 1 p.m. until 5 p.m. at the Marriott Marquis, just blocks from the Moscone Center.

To learn more, visit:

In case you missed it, here’s the link to the quarterly Market Statistics Service (MSS) report we published last week. It contains detailed revenue data for the EDA, Semiconductor IP, and design services industries. Overall, in first quarter 2016, we’re pleased to report industry revenues increased 4.5% compared to Q1, 2015. Total revenue for Q1 was $1962 million.

The ESD Alliance at DAC

Wednesday, June 15th, 2016

boots hatsThe Design Automation Conference is over. The cowboy boots, 10-gallon hats and “Keep Austin Nerdy” T-shirts have been put in storage until DAC returns to Austin next year. For those of you from the electronic system design ecosystem who didn’t get to Austin this year, here’s a look at what you missed.

The parties –– from the opening reception, Jim Hogan’s Heart of Technology and IPextreme’s annual Stars of IP party hosted by Silvaco to the not-to-be missed Cadence’s Denali evening –– were lively, the Pavilion panel sessions and keynotes well attended and the giveaways were first rate.

Exhibitor feedback was positive, from my sampling, though you may have heard that attendance was down in Austin. While the attendee numbers haven’t been posted as yet, exhibitors didn’t seem phased by the perceived lower attendance. In fact, many noted that while the traffic at the show was smaller than in San Francisco, it provided higher quality attendees and more highly qualified prospects.

DAC was a great opportunity for the new Electronic System Design (ESD) Alliance to “strut our stuff” (minus the cowboy boots and Stetsons). Attendees and exhibits showed loads of interest in the new organization and stopped by our booth to learn more about our new, expanded direction and initiatives. Better yet, several companies committed to joining the Alliance based on our refreshed mission and momentum. Many others have asked us to follow up over the coming months.

See You in Austin!

Thursday, June 2nd, 2016

DAC53_LongLogoA reminder that the ESD Alliance –– a proud DAC co-sponsor –– will exhibit at DAC in Booth (#1920) Monday, June 6, through Wednesday, June 8, from 10 a.m. until 6 p.m. at the Austin Convention Center, Austin, Texas. Please stop by our booth to say hello and to learn more about our support of the Design Ecosystem. We’ll have plenty of informational handouts, including the latest edition of our newsletter, brochures on our new initiatives and membership packets.

Or, join us at the DAC Pavilion (Booth #1839) for, “Solving the Design Cost Puzzle: How intellectual property (IP) Fits,” featuring Jim Feldhan, president of Semico Research, Tuesday from 10:30 a.m. until 11 a.m. Jim will address trends and issues driving the rapidly growing market for third-party IP.

You’ll find many of us from the Alliance at the Gary Smith EDA kickoff Sunday from 5 p.m. until 5:30 p.m. in the convention center’s Ballroom D. Laurie Balch, a chief analyst for Gary Smith EDA, will open the annual reception with the annual update on the state of EDA, “Extending the Bounds of EDA.” The always well-attended DAC reception immediately follows.

ESD Alliance at DAC in Austin

Thursday, May 19th, 2016

DAC53_LongLogoThe Design Automation Conference (DAC) is only a few short weeks away and the Electronic System Design Alliance will be there in full force. We continue to be a proud DAC co-sponsor –– a distinction we’ve had since 1992 –– and we’ll have a booth on the exhibit floor again this year. I hope you’ll stop by our booth (#1920) to learn more about the Alliance, our expanded mission and new initiatives in support of the Design Ecosystem. Exhibits will be open Monday, June 6, through Wednesday, June 8, from 10 a.m. until 6 p.m. at the Austin Convention Center in Austin, Texas.

We will host a DAC Pavilion (Booth #1839) talk, “Solving the Design Cost Puzzle: How intellectual property (IP) Fits,” featuring Jim Feldhan, president of Semico Research, Tuesday from 10:30 a.m. until 11 a.m. He will address trends and issues driving the rapidly growing market for third-party IP. This follows our joint announcement in April about a cooperative marketing partnership between Semico and the ESD Alliance to work together on several business initiatives in support of the semiconductor design ecosystem.

An Open Forum on System Scaling May 17

Wednesday, April 27th, 2016

ESDA_150 new logo - 2016-03-31We’re in the process of forming a working group on system scaling and welcome your input as a member of the chip design or semiconductor manufacturing ecosystems to help us set the direction. Join us for an open forum, “More than Moore –– Enabling the Power of System Scaling,” Tuesday, May 17, from 6 p.m. until 8:00 p.m. at the ESD Alliance/SEMI Global Headquarters in San Jose, Calif.

The host for the evening will be Herb Reiter of eda 2 asic Consulting who will lead a discussion on what it will take to propel system scaling solutions into the mainstream for semiconductor design and manufacturing. The goal of the meeting is to help the ESD Alliance identify priorities in both the manufacturing and design areas that will help unlock the potential of system scaling.mcm_1

System scaling offers an alternative path to pursuing Moore’s Law by moving the integration focus from the transistor to the integration of heterogeneous pre-fabricated and proven devices, including die-level IP, into an advanced IC package. As Herb points out, there are various system scaling technologies already in use today, such as interposer-based designs using die-level IP blocks, but they have not crossed into the mainstream.  Although new sub-10nm process technologies continue to drive Moore’s Law, development costs at these advanced nodes are beyond the reach of much of the conventional market.

Here’s where the ESD Alliance comes in. As an industry organization, we can facilitate interaction between modeling, design, analysis/verification, manufacturing and test in order to unlock the potential of these new integration solutions. We see the formation of the System-Scaling Working Group as a way to bring manufacturing and automation together to enable efficient and cost-effective use of advanced packaging technologies. The Alliance will be able to focus on expanding automation coverage and modeling, helping the industry leverage Moore’s Law in a new and powerful way. Most important, we see opportunities for our members to grow their businesses in automation, modeling and manufacturing.

ESD Alliance on a Roll …

Tuesday, April 19th, 2016

It’s been only a few short weeks since we launched the Electronic System Design (ESD) Alliance and we haven’t stopped there.ESDA_150 new logo - 2016-03-31

The party March 30 was a huge success, with more than 100 members of the design ecosystem community helping us celebrate our new name and expanded mission. The pictures show the support and enthusiasm better than I can in words. The slideshow can be found at:

For a look at why we made the sweeping changes, check out the March 31 news release found at:

Next up, we announced last week that well-known visionary, leader and technology investor Lucio Lanza, managing director of Lanza techVentures, has been appointed to the Board of Directors. We are especially pleased that he accepted the board’s invitation because he has tremendous insights and an astute understanding of the market. Fittingly, Lucio was the recipient of the Phil Kaufman Award for Distinguished Contributions to EDA in 2014 for his substantial impact on EDA through his strategic and financial assistance to innovative EDA companies. Welcome, Lucio! The news release with details can be found at:

Join us! EDAC’s Launch Party Only Days Away

Thursday, March 24th, 2016

ESDA_150 new logo - 2016-03-31We’re only a few short days away from unveiling the EDA Consortium’s new name, new look and expanded mission to move us into the future. Based on the RSVPs, we’re expecting a huge crowd at our launch party Wednesday, March 30, that will feature wine and craft beer tasting and hors d’oeuvres. Don’t miss out on this stellar networking opportunity –– we have some of the industry’s top leaders coming.

BalloonsYes, the evening is meant to be a social gathering to celebrate the future of the Semiconductor design ecosystem, the critical driver of the worldwide semiconductor and electronic products markets. We’ll toast our storied past as well. I’ll interrupt the festivities with a short presentation on the new EDAC and will take the wraps off our new name and new look.

It’s not too late to register to join us. Everyone is welcome. The evening, open free of charge, starts at 6:30 p.m. and will run until 8:30 p.m. at the EDA Consortium/SEMI Global Headquarters, 3081 Zanker Road in San Jose, Calif. For registration details, go to:

We look forward to seeing you and sharing our vision.

EDA Consortium Moves into the Future

Wednesday, March 9th, 2016

EDAC_EDAC Connected Logo_December 2015
The EDA Consortium is moving into the future and you’re invited to help us celebrate at a launch party where we will unveil our new name, expanded mission and a new look.Celebrate

Our wine and craft beer tasting evening with hors d’oeuvres will be held Wednesday, March 30, starting at 6:30 p.m. and running until 8:30 p.m. We’ll be at the EDA Consortium/SEMI Global Headquarters, 3081 Zanker Road in San Jose, Calif.

Many longtimers will remember when EDAC was formed in 1989 to address cross-industry issues and promote the EDA industry. It was the “go-go” years for electronic design automation that seemed never-ending and our tagline said it all: “Where Electronics Begins.” Lively EDAC events became the place to network. We became a co-sponsor of DAC in 1992. In 1994, the Market Statistics Service (MSS) reporting began. The Phil Kaufman Award was created that year as well and presented to Hermann Gummel, a Semiconductor and EDA industry pioneer.


EDAC-Hosted Jim Hogan in Conversation with Ajoy Bose Event Next Week

Monday, February 22nd, 2016

EDAC_EDAC Connected Logo_December 2015I’m out of town this week with the DAC Executive Committee –– EDAC is one of DAC’s three sponsors ––as we put the finishing touches on this
year’s program. While details won’t be available for a few more weeks, I can say that the program is looking very strong this year with a lot of technical diversity including security, IoT, automotive, IP, and a few more surprises.


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