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 Bridging the Frontier

Archive for November, 2016

A Busy December with REUSE 2016, Updates to Multi-Die IC Design Guide, New Member Outreach

Tuesday, November 22nd, 2016

While 2016’s coming to an end, it’s not quite over yet and the month of December will be busy for the ESD Alliance.

Our industry has one brand new event called REUSE 2016 that will take place Thursday, December 1. The ESD Alliance will be there, along with close to 40 other exhibitors.

REUSE 2016 is the first of an annual conference and trade show to bring together the semiconductor IP supply chain and its customers for a full day of everything to do with semiconductor IP. It will be held from 11 a.m. until 8 p.m. at the Computer History Museum in Mountain View, Calif. Admission is free.reuse_lg_fb

I’m moderating a conversation during REUSE with Lucio Lanza, managing director of Lanza techVentures, and Dan Rubin, general partner of Alloy Ventures. We’ll talk about the semiconductor IP market and IoT during the discussion titled, “IoT: Poised to offer huge growth opportunities for the global IP Business.”


First Visit to DVCon Europe Leaves Positive Impression

Wednesday, November 2nd, 2016

2016DVConEurope_logoI had the pleasure of attending DVCon Europe in Munich, Germany, in mid-October to give the keynote address at the gala dinner. This was my first visit to the conference and I was impressed. As Oliver Bell of Intel and DVCon’s general chair wrote in his welcome greeting in the program, DVCon Europe is a practical, industry application-oriented conference, focusing on design and verification of electronic systems and integrated circuits. I found that to be absolutely true and then some. According to OneSpin’s Vice President of Marketing Dave Kelf, this year’s promotions chair, the conference attendance increased 20%. Kudos to the Steering Committee.

DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IoTPLL

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