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 Bridging the Frontier
Bob Smith, Executive Director
Bob Smith, Executive Director
Robert (Bob) Smith is Executive Director of the EDA Consortium. He is responsible for the management and operations of EDAC, an industry group that provides services, market awareness and a common voice for EDA and IP suppliers to the global semiconductor industry. Previously, Bob was senior vice … More »

Visit the Electronic System Design (ESD) Alliance at SEMICON West

July 11th, 2016 by Bob Smith, Executive Director

If you are planning to attend SEMICON West, please put the ESD Alliance booth on your Must See list so you can learn more about us. We will be in booth N1 in the North Hall at the Moscone Center in San Francisco. Exhibit hours are Tuesday, July 12, and Wednesday, July 13, from 10 a.m. until 5 p.m., and Thursday, July 14, from 10 a.m. until 4 p.m.


During SEMICON West, I will be a panelist on “The Path to Semiconductor and MEMS/Sensors Common Best Practices for Growth” discussion Wednesday from 2 p.m. until 3 p.m. It’s part of a workshop organized by SEMI and the MEMS & Sensors Industry Group titled, “From Collision to Convergence: Co-Creating Solutions in the Semiconductor and MEMS/Sensors Industries.” The workshop will run from 1 p.m. until 5 p.m. at the Marriott Marquis, just blocks from the Moscone Center.

To learn more, visit:

In case you missed it, here’s the link to the quarterly Market Statistics Service (MSS) report we published last week. It contains detailed revenue data for the EDA, Semiconductor IP, and design services industries. Overall, in first quarter 2016, we’re pleased to report industry revenues increased 4.5% compared to Q1, 2015. Total revenue for Q1 was $1962 million.

Our spring newsletter, handed out at last month’s DAC, is chock-full of news about the ESD Alliance’s news and activities. We’re particularly enthused by the Committee Updates. If you haven’t seen this issue, I encourage you to have a look at:

Finally, not everyone in the design ecosystem knows who I am. To read a recently written profile of me, go to:

And, don’t forget to get your copy of the latest version of the Multi-Die IC Design Guide with an up-to-date backgrounder on multi-die IC integration techniques and technologies. It includes a listing of vendors who offer multi-die IC design and manufacturing solutions and services as well. The design guide, compiled by Herb Reiter of eda2asic who is heading our System Scaling Working Group, can be downloaded from:

For more information about the ESD Alliance, visit:

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