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 Bridging the Frontier
Bob Smith, Executive Director
Bob Smith, Executive Director
Robert (Bob) Smith is Executive Director of the EDA Consortium. He is responsible for the management and operations of EDAC, an industry group that provides services, market awareness and a common voice for EDA and IP suppliers to the global semiconductor industry. Previously, Bob was senior vice … More »

An Open Forum on System Scaling May 17

April 27th, 2016 by Bob Smith, Executive Director

ESDA_150 new logo - 2016-03-31We’re in the process of forming a working group on system scaling and welcome your input as a member of the chip design or semiconductor manufacturing ecosystems to help us set the direction. Join us for an open forum, “More than Moore –– Enabling the Power of System Scaling,” Tuesday, May 17, from 6 p.m. until 8:00 p.m. at the ESD Alliance/SEMI Global Headquarters in San Jose, Calif.

The host for the evening will be Herb Reiter of eda 2 asic Consulting who will lead a discussion on what it will take to propel system scaling solutions into the mainstream for semiconductor design and manufacturing. The goal of the meeting is to help the ESD Alliance identify priorities in both the manufacturing and design areas that will help unlock the potential of system scaling.mcm_1

System scaling offers an alternative path to pursuing Moore’s Law by moving the integration focus from the transistor to the integration of heterogeneous pre-fabricated and proven devices, including die-level IP, into an advanced IC package. As Herb points out, there are various system scaling technologies already in use today, such as interposer-based designs using die-level IP blocks, but they have not crossed into the mainstream.  Although new sub-10nm process technologies continue to drive Moore’s Law, development costs at these advanced nodes are beyond the reach of much of the conventional market.

Here’s where the ESD Alliance comes in. As an industry organization, we can facilitate interaction between modeling, design, analysis/verification, manufacturing and test in order to unlock the potential of these new integration solutions. We see the formation of the System-Scaling Working Group as a way to bring manufacturing and automation together to enable efficient and cost-effective use of advanced packaging technologies. The Alliance will be able to focus on expanding automation coverage and modeling, helping the industry leverage Moore’s Law in a new and powerful way. Most important, we see opportunities for our members to grow their businesses in automation, modeling and manufacturing.

Please mark your calendars and plan to attend. The evening is free of charge and open to members of the design and manufacturing community interested in system scaling. The evening will start at 6 p.m. with networking, food and beverages prior to the open discussion that will begin at 6:30 p.m. The formal program will be finished by 8 p.m., although we encourage networking to continue on afterward. To register, go to:

The ESD Alliance/SEMI Global Headquarters is located at 3081 Zanker Road in San Jose, Calif.

For more information about the ESD Alliance, its various committees or to learn about becoming a member, visit: Or, contact me directly at:

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