Posts Tagged ‘EDA360’
Wednesday, January 18th, 2012

One lingering question for 2012 is what will become of the Magma back-end platform? I predict that Synopsys will phase out the Magma Talus platform in favor of ICC. Why? It makes no sense for Synopsys to continue to field and support two different systems although it is likely that there will be some transfer of technology into ICC. Converting the existing Talus user base over to ICC is no small task and will likely take several years to complete as well as require incentives and utilities to move the existing base over to the Synopsys platform.
Timing verification is another story. Synopsys will capitalize on the acquisitions of Extreme and Magma to leverage the technologies in those products to develop and deliver the next generation PrimeTime platform. Once they complete this, they will have re-solidified their position as the industry golden standard in static timing verification.
It will be very interesting to see how the consumer-driven SoC market will evolve. SoCs used to be comprised of a processor, memory, various IP blocks, and the on-chip infrastructure needed to support them such as clock, power and communications channels. Now SoCs have multiple processors, large numbers of IP blocks, multiple on-chip communications channels and multiple memories. In essence, today’s SoCs are comprised of multiple SoCs as we used to define them.
The 2012 SoC will beget big challenges in design and even more so in verification. IP will become more important. And even though hardware performance and power will matter, system design and software will become the differentiating items.
SoC system design and verification will be especially active, because it is what the system does that really counts. (After all, the point of building an SoC is to deliver a winning end product.) To a great extent that will require a huge software and verification effort — under the schedule pressures that come from a hugely competitive consumer products market.
Bob Smith
Industry Consultant
rpsmith1403@comcast.net
Tags: 2012, EDA, EDA & IP, EDA360, Electronic Design Automation, ICC, IP, Lee PR, Magma, PrimeTime, Semiconductor IP, semiconductors, SoC, Synopsys, System on Chip, Talus, www.leepr.com No Comments »
Tuesday, January 17th, 2012

In 2012, we will see a bigger presence from companies like Ansys and Dassault giving much competition to the big three. Cases in point are the Ansoft and Apache acquisitions by Ansys. We thus might see further consolidation among the top EDA companies. To handle some of the pressure, I do believe the big three will once again realize the need for new ideas and begin to look further into acquiring new and cool technology earlier.
Jens C. Andersen
CEO
Invarian, Inc.
www.invarian.com
Tags: 2012, EDA, EDA & IP, EDA360, Electronic Design Automation, Invarian, IP, Lee PR, Semiconductor IP, semiconductors, www.leepr.com No Comments »
Monday, January 16th, 2012

I think that there will continue to be consolidation in the EDA industry. At each process node, fewer and fewer designs ship in high enough volume to recover the enormous investment in bringing them to market, which is a bad trend for EDA. Several companies in the ecosystem will go public if the market conditions remain favorable: eSilicon, Tensilica, Atrenta. Although, as with Apache, they may get acquired at the last minute (at high valuations). Mentor may get acquired, or sell off some business lines.
Paul McLellan
Blogger, semiwiki.com
www.semiwiki.com
Tags: 2012, Atrenta, EDA, EDA & IP, EDA360, Electronic Design Automation, eSilicon, IP, Lee PR, Mentor, Semiconductor IP, semiconductors, semiwiki.com, Tensilica, www.leepr.com No Comments »
Wednesday, January 11th, 2012
And the predictions begin……

With regard to “Events” – 2012 will be a year of further acquisition and consolidation for both the EDA and IP industries. Some new faces will join the dance, with significant resources at their disposal. It is likely the “Big 3″ will have at least one new name in a year’s time.
With regard to “Breakthroughs” – it’s a different story. 3D stacked-die design still won’t be mainstream in a year’s time. True hardware/software co-design will still be a developmental area and verification will still be as hard as ever. Many panels, blogs, seminars and special conference sessions will debate these topics throughout the year with great hope and excitement, however.
Mike Gianfagna
Vice President of Marketing
Atrenta Inc.
http://www.atrenta.com/
Tags: 2.5D, 2012, 3D, 3D stacked die, Atrenta, EDA, EDA & IP, EDA360, Electronic Design Automation, IP, Lee PR, Semiconductor IP, semiconductors, www.leepr.com No Comments »
Tuesday, January 10th, 2012

Step aside Nostradamus and Mayans. The real earth-shattering events of 2012 could take place in the EDA & IP industries. We asked industry friends, associates, clients and media folks to ponder what industry-shattering events or breakthroughs we might see in EDA & IP this coming year.
So what topics came up? Consolidation of the industry; standards; various technologies, 3D being the most discussed; even one man’s blatant personal goal. :-)
We heard the word “challenge” a lot, for the big vendors and the smaller companies. So will two foundry-led EDA mega-companies duke it out with a third mega-company, as one diviner foretold? Tough to tell how tongue-in-cheek his prophesy was.
So we’ll post the visionary comments of one individual at a time, in the order they came into us. We found them enlightening and even entertaining! We hope you do too.
Liz and Ed
Tags: 2.5D, 2012, 3D, 3D stacked die, EDA, EDA & IP, EDA360, Electronic Design Automation, IP, Lee PR, Semiconductor IP, semiconductors, www.leepr.com No Comments »
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