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Posts Tagged ‘electromigration’

Custom Compiler In-Design Assistants (Part 3)

Tuesday, September 20th, 2016

In the blog ‘Custom Compiler In-Design Assistants (Part 2)’, I outlined how we can use StarRC to report capacitances on critical nets in the layout even when the design is still in flux and not completely LVS-clean. In addition to capacitance reports, we also showed resistance reporting which is critical for FinFET-based layouts. At advanced nodes, the impact of parasitics, electromigration (EM) and restricted design rules drive critical layout choices. Interconnect that does not meet resistance, or EM criteria and unbalanced capacitances on matched nets, can and often does adversely impact layout schedules. So the earlier in the layout phase the layout engineer can address these issues, the sooner he or she can close the design.

EM in particular is a notorious problem in the FinFET process due to the high drive of the transistors and thin metals. So let’s say, for example, the layout engineer has to route a critical net which could be susceptible to the impact of EM. This is a non-trivial task that could be quite challenging. However, if you use Custom Compiler, there are some very cool capabilities that make laying out interconnect that meets EM criteria very quick and very easy.

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Breaking News: The Wait is Over!

Wednesday, March 30th, 2016

Over the last few blogs I have outlined some of the productivity challenges that the FinFET process brings with respect to custom layout. Today Synopsys unveiled Custom Compiler and ushered in a new era of visually-assisted automation. Custom Compiler has all the good stuff I’ve been saying is needed in earlier posts: a new custom design solution that closes the FinFET productivity gap by shortening custom design tasks from days to hours.

This is not a revamp of the old constraint-based legacy approach, it’s a fresh approach to custom design that employs visually-assisted automation technologies to speed up common design tasks, reduce iterations and enable reuse.

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What’s visually-assisted automation, you may ask?

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Hurricane FinFET (Part 3)

Friday, March 18th, 2016

Continuing on the theme of FinFET layout, let’s consider what you have to do for routing. Again drawing on the experience of my layout colleagues who are still ‘in the business’ and dealing with FinFETs, here are a few landmines you will have to deal with.

One particular issue they encounter is that although the base layers have shrunk considerably, the shrink of the routing layers has not kept pace. Each new node has brought us smaller transistors, but the minimum metal pitch has not really changed. This really impacts layout floorplanning because designs that were once dictated by device area are now dictated by the ability to route the required signals. Double-/triple-patterning compounds the issue even further.
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