Last week I attended the Design Automation Conference as an intrepid reporter to put my ear to the ground and take note of what is happening in the industry. I wrote some daily review blogs of my time on the show floor (which can be seen here, Day 1, Day 2, Day 3) but I have come up with some talking points from the conference. These are the topics that I found got most air time both in the booths and in the many speeches, presentations and panel discussions across the week. Let me know what you think about them in the comments section below.
On Tuesday morning the VP of Samsung Electronics Foundries gave an insightful presentation on their advancements over the past 12 months and their vision for the foreseeable future. His words carry an extra amount of weight when you consider that in 2014 he promised 14nm silicon in a year’s time and was able to deliver on his word. It was not done in a silo however, and the phrase he used of “relentless collaboration” between EDA, IP companies and foundries is absolutely crucial to marching on with the progress he outlined, of seeing silicon for 10nm in 2016. The other key point he made was that each foundry process must be aligned to and optimized for the target segment. For example reducing the process node for server density and mobile, but there is still plenty of innovation at higher nodes for automotive, wearable and of course IoT. The same breakfast session showed proof of what can happen when partners collaborate. ARM®, Synopsys and Samsung managed to implement a quad-core Cortex®-A53 processor design with CoreLink™ CCN-502 designed for networking on a 14nm LPP process in a timescale of just four weeks.