ARM Ltd. 
Part Number : ROM
Overview :
ARM® Memory IP solutions include Diffusion and Via/Contact programmable ROMs suited for high density and low power applications. ROM compilers are available in over 15 different foundries and 65 process variants from 28 nm to 250 nm
Features : - High density and low power architecture
- Minimizes die area to reduce die and packaging cost
- Multiple power management modes with power gating and multi-voltage operation
- Flexible power management allows packaging cost reduction, competitive product with higher battery life
- Flexible margining features Allows yield/performance tradeoff
- Optional integrated pipeline Allows high throughput
- Soft Error repair Enables yield optimization
- Advanced test features Enhances product quality and minimizes field returns
Categories :
Portability :
Type : Soft

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