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 Sankalp Semiconductors Pvt Ltd 
Short Desc. : SGIO_IO_T065GP-LVDS33_TERM_RX_CUP - 3.3 V, 750 MHz LVDS Reciever with Input Termination
Overview :
LVDS33_TERM_RX_CUP belongs to S_GPI_IO_T065GP, which is Sankalp’s General Purpose IO library in 65nm TSMC G+ process single poly 9M. It is a LVDS cell which operates on 3.3 V supply, at frequencies upto 750 MHz (1.5 Gbps). It contains a input termination of 100 ohms. Power supply sequencing independent (PSSI), Wire bond & Flip chip compatible are some of the salient features for this cell. Cell dimensions are 50um x 170um.
Features : - 1.0 V and 2.5 V devices overdriven to save mask cost
- Operates at frequencies up to 750 MHz or 1.5 Gbps
- Sensitivity of 100 mV peak differential
- Common mode range from 0 V to 2.4 V
- Core supply of either 1.0 V or 1.1 V (+/- 10%)
- I/O supply of 3.3 V (+/- 10%)
- Operates over temperature range of 40C to 125C
- ESD hardness of 2kV HBM, 500V CDM
- Latchup immune upto +/- 100 mA current injection
- Wire-bond and Flip-chip compatible
- Supports 8-layer (602) or 9-layer (702) metallization with Circuit-Under-Pad (CUP)
- Power supply sequence independent (PSSI)
- Compatible to IEEE 1596.3-1996 specification
- Compatible ANSI TIA/EIA-644 specifications
- Also available without 100 ohm input termination
Categories :
Portability :
Type : Soft
Deliverables : - Specifications, GDSII, LEF, LVS netlist, Verilog Model and Timing Model
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