TES Electronic Solutions 
Short Desc. : D/AVE 3D
Overview :
D/AVE 3D is an IP core for 3D graphics applications. This core is available in 2 versions FPGA and for ASIC. This IP has been specifically designed for embedded, automotive and infotainment market with a big emphasis on flexibility both in hardware and the software. Accompanying the core would be an OpenGL-ES 1.1, EGL 1.3 and OpenVG 1.0 1 API.
Features : - Low resource usage
- Low gate count ( ~1Mio. Gates for ASIC)
- Low internal memory requirements ( ~125 K Memory Bits)
- 70K Logic elements for FPGAs
- Offers a wide range of graphical primitives
- Lines, Triangles, Quadrangles
- Prepared for easy SoC integration
- Performance robust to high memory latency
- Single clock domain architecture
- High Performance
- 100 Mio. Pixels/Second fill rate (100 MHz)
- 6,6 Mio. triangles throughput (100 MHz.)
- Early-Z-Test
Categories :
Portability :
Type : Soft
S2C: FPGA Base prototyping- Download white paper

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