This year’s 5th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
3D-printing has come a long way. Single material became multi-material with an ever-growing degree of detail and perfection. But that was just the beginning. As the world of 3D-printing is evolving, electronics is quickly becoming a new key player. Functional elements such as sensors and switches are now being integrated into 3D-printed products, paving the way for exciting new markets, applications and opportunities.
Thought leaders of this emerging market are converging in Eindhoven during the 3D Printing Electronics Conference to share their knowledge and expertise. Learn about 3D-printed embedded electronics in cars, pended optics and the 3D-manufacturing of smartphone antenna’s.
On the crossroads of science, technology and business in 3D-printing electronics they will fill you in on the latest breakthroughs, cutting edge research and business opportunities. Visit the upcoming edition of the 3D Printing Electronics Conference to share knowledge, create new partnerships and network actively..
DesignCon, the premier conference for chip, board, and systems design engineers, returns to Silicon Valley for its 22nd year. DesignCon serves the high speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities.
Taking place annually, DesignCon remains the largest gathering of chip, board, and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos, and exhibits; DesignCon brings engineers the latest theories, methodologies, techniques, applications, and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components, and more.
With more than 100 sessions spanning 14 tracks, the Technical Conference Program covers all aspects of electronic design; from chips through boards and systems.
In today’s world, there is an enormous amount of data that requires robust processing power to make intelligent decisions for applications from image, pattern, and speech recognition to natural language processing and video analysis. The applications for convolutional neural networks are here and growing.
Cadence is hosting the Embedded Neural Network Summit 2017, Deep Learning: The New Moore’s Law, showcasing experts who have a profound understanding of convolutional neural networks and have applied these complicated algorithms in various products and applications. Attendees will be treated to a panel discussion at the end of the speaking sessions.
Advancements in solid-state circuits and systems continue to propel the ongoing fusion between the physical and virtual worlds. With the resulting growth in sensor deployment, data traffic and data center workloads, future systems must employ “intelligent” chips at all levels of the system stack to improve the efficiency at which we acquire, network, store, and process information. Modern applications centered around the Internet of Everything (IoE) and real-time data analytics are driving circuit and system designers toward new ways of leveraging the immense device density and processing power of modern technology. The ISSCC 2017 is seeking innovations that will fuel further progress in this development toward a truly smart and interconnected world.
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
North America's Largest Annual Design & Manufacturing Event
Electronics West connects you with over 20,000 engineers and executives, as well as thousands of leading suppliers, across the advanced design and manufacturing spectrum who all understand the value in working together on the industry's cutting edge.
This your chance to learn from industry luminaries as they present their insights and find electronics technology, innovation, and inspiration to take back to the office. It's three days of industry immersion that electronics professionals simply can't afford to miss.
SEMICON Korea 2017 will be held from February 8 to 10 and be the largest in its 30 year history!
In the electronics industry there is a point where inspiration turns into innovation. A point where the industry turns exceptional education and technology into real-world success. IPC APEX EXPO 2017 is an opportunity to experience technology's turning point—see you in San Diego!IPC APEX EXPO 2017 is a five-day event like no other in the printed circuit board and electronics manufacturing industry. Professionals from around the world come together to participate in the Technical Conference, Exhibition, and Professional Development, Standards Development and Certification programs. These activities offer seemingly endless education and networking opportunities that impact your career and company by providing you the knowledge, technical skills and best practices to address any challenge you face.
The 2017 HIMSS Annual Conference & Exhibition, February 19–23, 2017 in Orlando, brings together 40,000+ health IT professionals, clinicians, executives and vendors from around the world. Exceptional education, world-class speakers, cutting-edge health IT products and powerful networking are hallmarks of this industry-leading conference.
25th ACM/SIGDA International Symposium on Field-Programmable Gate Arrays
Early registration deadline: January 31, 2017