Enjoy 3 session-packed days of industry education and training, including topics on next-gen manufacturing, product design, packaging, and medical technology. Click the 'Full Agenda' button for details on this year's presentation line-up.
In today’s world, there is an enormous amount of data that requires robust processing power to make intelligent decisions for various applications from image, pattern, and speech recognition to natural language processing and video analysis. The application areas for convolutional neural networks are growing in the mobile, automotive, consumer and IoT worlds.
Cadence is hosting an Embedded Neural Network Summit, Extending Deep Learning into Mass-Market Silicon, with experts that have deep understanding of convolutional neural networks and have applied these complicated algorithms in various products and applications. Attendees will be treated to a panel discussion at the end of the speaking sessions.
The 24th annual ACM International Symposium on Field-Programmable Gate Arrays (FPGA’16) will take place February 21 through 23 in Monterey, California.
It will feature a panel discussion assessing the impacts of the recent acquisition of Altera by Intel. Will this major change in the FPGA business landscape lead to better integration of FPGAs and mainstream CPUs? Facilitate wider use of FPGAs in data centers? Impact FPGA pricing? Are mergers in store for other FPGA manufacturers? These and other questions will be addressed by our panelists:
Mobile World Capital Barcelona is a shared vision and collective action to transform Barcelona into a mobile and digital hub while improving people’s lives.
HIMSS North America, a business unit within HIMSS, positively transforms health and healthcare through the best use of information technology in the United States and Canada. As a cause-based non-profit, HIMSS North America provides thought leadership, community building, professional development, public policy, and events. HIMSS North America represents 61,000 individual members, 640 corporate members, and over 450 non-profit organizations.
DVCon attendees have the opportunity to take part in the many informal, but often intense, technical discussions that pop-up around the conference venue among 800+ design and verification engineers and engineering managers. This networking opportunity among peers is possibly the greatest benefit to DVCon attendees. Finally, DVCon attendees have access to the vendors of advanced design and verification tools, IP/VIP and services who exhibit at the conference.
Plan now to attend 2016FLEX Conference & Exhibition. Spend several productive days seeing and hearing the latest breakthroughs and developments in Flexible, Printed and Hybrid Electronics. Join other electronics professionals as they gather to explore bringing technology and products successfully to market through presentations, courses, exhibits and networking. Now in its 15th year, the Flex Conference will again commence on the beautiful Monterey Peninsula on California’s Pacific coastline. Monterey brings the fun and intimacy of the resort-setting to the professional and technology development focus of the event. Business and pleasure mix well in this beautiful location.
he impulse to break a new gadget to "see what's inside" is often the first sign someone will become an engineer. However, modern teardowns go far beyond pure curiosity: they provide us critical insights into the nature and construction of these devices. In this talk we will cover the teardown of several gadgets, from the early Blackberries to the Apple Watch, to understand how the SMT industry has changed.
A new age is dawning in the micro/nano-electronics industry as the use of ever more complex and capable chips is complemented by a developing demand for smart systems to fuel the Internet of Everything.
The MIPI® Alliance is a non-profit corporation that operates as an open membership organization. All companies in the mobile device industry are encouraged to join, including semiconductor companies, software vendors, IP providers, peripheral manufacturers, test labs and end product OEMs. Today, more than 275 member companies actively participate in the Alliance, developing interface specifications which drive consistency in processor and peripheral interfaces, promoting reuse and compatibility in mobile devices.