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Pan Pacific Microelectronics Symposium
Date: February 2 - 5, 2015
Place: Kauai Island, HI USA

The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

SEMICON Korea 2015
Date: February 4 - 6, 2015
Place: COEX, Seoul, Korea (South)

SEMICON Korea will be held from February 4 - 6 in Seoul,featuring over 500 exhibiting companies from 20countries and more than 45,000 attendees.

SEMICON Korea 2015 is the leading semiconductor technology event to explore the latest market trends and future developments for technology, featuring extensive technical forums, business programs and standards programs.

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices
Date: February 10, 2015
Place: 5200 Willson Road
Suite 215, Edina, MN 55424 USA

What You Can Learn From This Course:
Electromigration is migration of metal materials driven by the high current density. With the continuous miniaturization and increasing versatility and speed of electronic devices, the current density of miniaturized solder joints is getting so high that the solder joint integrity deteriorates rapidly due to electromigration. This is particularly true for high power devices. This course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. Electromigration behavior within redistribution layer is also reviewed and discussed. Most importantly, recommendation will be provided about how to achieve long life under high current-stressed conditions for solder joints and redistribution layer through optimized designs.

Outline:
1)EM mechanisms

Effect of current density and temperature
EM path through solder, Al, and Cu
Effect of solder grain orientation
Effect of solder composition

2) EM resistance of solder joints
Sn vs Pb
Pb-containing vs Pb-free
Relative resistance of solder, Cu, Ni, and IMC
Effect of solder volume
Relative performance of solder joints with variation in metallurgy and configuration
Recommended designs of solder joints for superior EM resistance

3) EM resistance of RDL
Effect of via diam, pad opening, Cu thickness of UBM, size of taper trace, configuration of RDL vs via location and solder location


Who Should Attend:
Any one who wants to know the electromigration phenomenon in details and wants to know how to prevent electromitration within their products should take this course.

Electronics West
Date: February 10 - 12, 2015
Place: Anaheim Convention Center
Anaheim, CA USA

"I had a great time interacting with different vendors at the show. I think this is the best venue for seeing the actual product that I have read about in publications. Some of the products on display are simply amazing."

International Solid-State Circuits Conference (ISSCC)
Date: February 22 - 26, 2015
Place: San Francisco, CA USA

Welcome to the 2015 IEEE international Solid-State Circuits Conference (ISSCC) web site. The conference theme for 2015 is SILICON SYSTEMS — SMALL CHIPS for BIG DATA

SILICON SYSTEMS — SMALL CHIPS for BIG DATA
Big Data generated by IoT, healthcare, and WWW, are changing our lifestyle and our society. Small silicon chips are enabling this change through data sensing, gathering, processing, storing, and networking through wireless and wireline connection. Recent silicon-system technologies including ultra-low-power systems, high-performance circuits and systems, wireless power and data transmission, and 3D IC structures, will open the door to Big-Data applications.

IPC APEX EXPO 2015
Date: February 24 - 26, 2015
Place: San Diego Conference Center
111 W Harbor Drive , San Diego, CA 92101 USA

What drives what happens now? A critical combination of the latest technology and knowledge, which is what you'll find at IPC APEX EXPO 2015. Attend and be part of the year's best opportunity to gain knowledge and experience applied technology with real-world applications. It will be where you upgrade your tech-NOW-ledgy.

Free VLSI Workshop 2015
Date: February 28, 2015
Place: Bangalore, India

I am very glad for this opportunity to interact with the student community and share my experience through this workshop. I have personally designed this workshop agenda, after long contemplation on the needs of fresh electronics engineers. I am sure this workshop will help the attendee to understand the complete front-end design flow as well as the concepts of RTL design and Verification. In addition to imparting the technologies, I am going to talk about the Indian Semiconductor Industry and the VLSI Job opportunities. So participate in this workshop, interact with me and learn from my experience. This workshop will help if you are very passionate about VLSI technology and want to work in the Chip Design Industry. Looking forward to meeting you all during this workshop.

DVCon 2015
Date: March 2 - 5, 2015
Place: Double Tree
San Jose, CA USA

Exhibiting at DVCon is a proven way to spend quality time with the people you most want to meet - your customers!

At DVCon, customers will be visiting your booth looking for solutions! This is your opportunity to maximize your marketing ROI, promote your brand and awareness, expand your customer base and SELL your products!



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Upcoming Events
Pan Pacific Microelectronics Symposium at Kauai Island HI - Feb 2 - 5, 2015
SEMICON Korea 2015 at COEX Seoul Korea (South) - Feb 4 - 6, 2015
Electronics West at Anaheim Convention Center Anaheim CA - Feb 10 - 12, 2015
CAD/SW Engineer



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