This year’s 5th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
3D-printing has come a long way. Single material became multi-material with an ever-growing degree of detail and perfection. But that was just the beginning. As the world of 3D-printing is evolving, electronics is quickly becoming a new key player. Functional elements such as sensors and switches are now being integrated into 3D-printed products, paving the way for exciting new markets, applications and opportunities.
Thought leaders of this emerging market are converging in Eindhoven during the 3D Printing Electronics Conference to share their knowledge and expertise. Learn about 3D-printed embedded electronics in cars, pended optics and the 3D-manufacturing of smartphone antenna’s.
On the crossroads of science, technology and business in 3D-printing electronics they will fill you in on the latest breakthroughs, cutting edge research and business opportunities. Visit the upcoming edition of the 3D Printing Electronics Conference to share knowledge, create new partnerships and network actively..
DesignCon, the premier conference for chip, board, and systems design engineers, returns to Silicon Valley for its 22nd year. DesignCon serves the high speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities.
Taking place annually, DesignCon remains the largest gathering of chip, board, and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos, and exhibits; DesignCon brings engineers the latest theories, methodologies, techniques, applications, and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components, and more.
With more than 100 sessions spanning 14 tracks, the Technical Conference Program covers all aspects of electronic design; from chips through boards and systems.
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
In the electronics industry there is a point where inspiration turns into innovation. A point where the industry turns exceptional education and technology into real-world success. IPC APEX EXPO 2017 is an opportunity to experience technology's turning point—see you in San Diego!IPC APEX EXPO 2017 is a five-day event like no other in the printed circuit board and electronics manufacturing industry. Professionals from around the world come together to participate in the Technical Conference, Exhibition, and Professional Development, Standards Development and Certification programs. These activities offer seemingly endless education and networking opportunities that impact your career and company by providing you the knowledge, technical skills and best practices to address any challenge you face.