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SEMICON Japan 2014 - Dec. 3 - 5, 2014 - Tokyo Big Sight, Tokyo, Japan
Date: December 3 - 5, 2014
Place: Tokyo Big Sight
3 Chome-11 Ariake, Tokyo, Japan

SEMICON Japan 2014: New Venue and New Ideas for Rebounding Industry

SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology, will take place at its new venue in Tokyo Big Sight in Tokyo on December 3-5.

SEMICON Japan 2014 will bring Japan’s rebounding semiconductor equipment market into focus and the underlying technology and business drivers.  SEMICON Japan will enable attendees to explore key technologies and business models necessary to grow in the coming years. On December 3, SEMICON Japan opens at 9:30am with a full day of speakers including:  

  • Accenture Japan Ltd — Chikatomo Hodo, president and country managing director
  • IBM Japan — Chieko Asakawa, IBM fellow
  • Scripps Translational Science Institute — Donald Jones, chief digital officer
  • Toyota — Tokuhisa Nomura, executive general manager
  • Intel Japan — Makiko Eda, GM and president of Intel Japan
  • ARM K.K. — Yuzuru Utsumi, president
  • Toshiba — Yasuo Naruke, executive officer, corporate EVP and CEO, semiconductor & storage
  • National Institute of Information and Communication Technology (NIICT) — Miwako Doi, auditor

Date: Dec. 3 - 5, 2014 
Location: 
Tokyo Big Sight, Tokyo, Japan

3D ASIP Conference
Date: December 10 - 12, 2014
Place: The Hyatt Regency San Francisco Airport
1333 Bayshore Highway , Burlingame, CA 94010 USA

Mark your calendar and plan to attend the 11th annual 3D ASIP conference. 3D ASIP gives you the opportunity to gain the latest and most comprehensive insights on market trends, and manufacturing and technology developments in the world of advanced interconnect and packaging.

IEEE Electrical Design of Advanced Packaging & Systems Symposium. Dec 14 - 16, 2014 in India
Date: December 14 - 16, 2014
Place: World Trade Centre
Brigate Gateway, Malleswaram West,, Bangalore, India

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements. The symposium consists of keynote and invited talks from experts, paper presentations, industry exhibition, tutorials and an informal social setting for networking.

Dates: 14 Dec, 2014  To: 16 Dec, 2014
Location: World Trade Centre, Brigate Gateway, Malleswaram West, Bangalore, India.



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Upcoming Events
SEMICON Japan 2014 - Dec. 3 - 5, 2014 - Tokyo Big Sight, Tokyo, Japan at Tokyo Big Sight 3 Chome-11 Ariake Tokyo Japan - Dec 3 - 5, 2014
3D ASIP Conference at The Hyatt Regency San Francisco Airport 1333 Bayshore Highway Burlingame CA - Dec 10 - 12, 2014
IEEE Electrical Design of Advanced Packaging & Systems Symposium. Dec 14 - 16, 2014 in India at World Trade Centre Brigate Gateway, Malleswaram West, Bangalore India - Dec 14 - 16, 2014
2015 European 3D TSV Summit January 19-21, 2015 Grenoble (France) at MINATEC innovation campus 3 parvis Louis Néel Grenoble France - Jan 19 - 21, 2015
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