SEMICON Japan 2014: New Venue and New Ideas for Rebounding IndustrySEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology, will take place at its new venue in Tokyo Big Sight in Tokyo on December 3-5.
SEMICON Japan 2014 will bring Japans rebounding semiconductor equipment market into focus and the underlying technology and business drivers. SEMICON Japan will enable attendees to explore key technologies and business models necessary to grow in the coming years. On December 3, SEMICON Japan opens at 9:30am with a full day of speakers including:
Date: Dec. 3 - 5, 2014 Location: Tokyo Big Sight, Tokyo, Japan
Mark your calendar and plan to attend the 11th annual 3D ASIP conference. 3D ASIP gives you the opportunity to gain the latest and most comprehensive insights on market trends, and manufacturing and technology developments in the world of advanced interconnect and packaging.
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements. The symposium consists of keynote and invited talks from experts, paper presentations, industry exhibition, tutorials and an informal social setting for networking.
Dates: 14 Dec, 2014 To: 16 Dec, 2014Location: World Trade Centre, Brigate Gateway, Malleswaram West, Bangalore, India.