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SMTA International 2016
Date: September 25 - 29, 2016
Place: Donald Stephens Convention Center
Rosemont, IL USA

The technical conference continued the tradition of being the strongest in the electronics assembly industry. The Evolving Technologies Summit at the beginning of the week received much praise as it covered key technologies such as Alternate Alloys and Wearable Technology. A crowd filled the Opening Keynote Session until it was standing-room-only on Tuesday morning to hear Yole Développement CTO, Rozalia Beica, give an impressive overview of 3D Technology Trends and Manufacturing Challenges. The Lead-Free Soldering Technology Symposium kept the meeting room packed until the very end of the conference.

Photonic Integration Conference
Date: September 27, 2016
Place: High Tech Campus
Eindhoven, Noord Brabant, 5656ea Netherlands

Integrated photonics drives next generation semi-conductor business

On September 27, 2016, the 2nd edition of the Photonic Integration Conference will take place at High Tech Campus Eindhoven, The Netherlands.

The following topics will be covered during the second edition:

  • Business models for applying Photonic Integration
  • Cases of Photonic Integration in optical sensing, lighting & energy, displays, information technology, telecom, healthcare & life science, security & defence, robotic manufacturing processe
  • Integration of photonics with microelectronics at the chip, board and system levels
  • Exploitation of new (Nano) materials
2016 GreenBuild International Conference and Expo
Date: October 5 - 6, 2016
Place: Los Angeles Convention Center
Los Angeles, CA USA

20,000+ Attendees 

GREENBUILD is the largest conference and expo in the world dedicated to green building and design. DRIVE TRAFFIC TO YOUR BOOTH 

Sponsorship opportunities can help DRIVE traffic to your booth, INCREASE your visibility and SHOWCASE your leadership in the green building industry.  We have designed them for maximum exposure to fit a variety of budgets.

27th IEEE International Symposium on Rapid System Prototyping (RSP)
Date: October 6 - 7, 2016
Place: PA USA

Call for Papers – IEEE RSP’2016

Important Dates:

  • Abstract submission: June 3, 2016
  • Paper submission: June 13, 2016
  • Notification of Acceptance: July 15, 2016
  • Final Camera Ready Manuscript due: August 29, 2016

For its 27th venue, the Rapid System Prototyping symposium seeks original contributions related to this target, encompassing a wide scope ranging from formal methods for the verification of software and hardware systems to case studies of emerging embedded systems and technologies. The RSP symposium continues as a part of the Embedded Systems Week that will be held this year in Pittsburgh, PA, USA. See for more details.

Suggested topics include, but are not limited to:

–      Rapid prototyping and emulation methods and tools

–     Specification models and methodologies for hardware/software systems

–     Emerging technologies, devices, boards, and applications

–     Prototyping experiences related to emerging technologies (memories, 3D integration, next generation wireless, IoT)

–     Prototyping of embedded systems for real-time, low power, and flexibility

–     Hardware and software platforms for IoT systems

–     Middleware for embedded systems

–     Model-driven engineering and prototyping

–     Reliability and failure analysis for embedded systems

–     Formal methods and verification/validation of embedded systems

–     Embedded system virtualization

–     Virtual prototyping and platforms for embedded systems

–     Prototyping methods and tools for reconfigurable computing

–     Rapid design approaches for application-specific processors

–     MPSoC and GPU-based system design and challenges

–     Hardware platforms and approaches for simulations acceleration

–     Industrial experiences in embedded system prototyping

The program committee invites authors to submit original unpublished full papers. Authors of selected papers will be requested to prepare a final camera-ready manuscript for the symposium proceedings and must register and attend the symposium for their paper to be published. Each technical paper must be associated with an author registration at full rate. Paper length should not exceed 7 pages and should use the standard IEEE format. Accepted and presented papers will be included in the IEEE RSP 2016 symposium proceedings and published in IEEE Xplore.

DASIP 2016
Date: October 12 - 14, 2016
Place: Rennes, France

The Conference on Design and Architectures for Signal and Image Processing – DASIP provides an inspiring international forum for the latest innovations and developments in the field of leading edge embedded signal processing systems. Theconference program will include keynote speeches, contributed paper sessions, demonstrations, and special sessions on timely topics.

SystemC AMS & COSIDE® User Group Meeting 2016
Date: October 18, 2016
Place: Maritim Hotel
Munich, Germany

We are very pleased to invite you to the SystemC AMS & COSIDE® User Group Meeting 2016. This year’s meeting will take place at the Maritim Hotel, Munich, Germany on Tuesday October 18, 2016. One day before the start of DVCON Europe 2016.

The electronic system level tool COSIDE® is the first commercially available environment fully supporting the SystemC & SystemC AMS language standards. COSIDE® enables overall system modeling and simulation for analog and digital as well as for hard- and software.

The SystemC AMS & COSIDE® UGM is the event in 2016 for all professionals, who are interested in the latest developments of SystemC AMS and COSIDE®. The meeting provides an open forum for the intensive exchange of knowledge by experienced industrial and academic users.

The detailed User Group Meeting program will be available soon. Participation for User Group Meeting 2016 is free of charge but early registration via e-mail at is highly recommended.

Call For Proposals Now Open!
Date: October 25 - 27, 2016
Place: Santa Clara Convention Center, Santa Clara, CA
California, CA USA

All relevant proposals—including topics other than those listed below—will be considered.

  • Technical papers and panel proposals are welcome
  • Technical tracks are listed below
  • Proposal deadline: Friday, June 10, 2016
  • Acceptance notification: Wednesday, July 20, 2016
  • Slides due: Monday, October 3, 2016
Date: October 25 - 27, 2016
Place: Grenoble, France

 Largest semiconductor event in Europe: nearly 5,000 industry experts, professionals and executives attendin

• 30% Increase in exhibition space*

• 10% Increase in show attendance*

• 20% Increase in attendance of Innovation Village — Hub for start-ups, investors and innovators

ARM TechCon 2016
Date: October 25 - 27, 2016
Place: Santa Clara Convention Center
Santa Clara, CA USA

ARM® TechCon™ is all about community. We invite attendees, speakers, exhibitors and press to connect with us via one or more of the social media channels below to stay up to date on the latest ARM TechCon news.

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Upcoming Events
Photonic Integration Conference at High Tech Campus Eindhoven Noord Brabant Netherlands - Sep 27, 2016
2016 GreenBuild International Conference and Expo at Los Angeles Convention Center Los Angeles CA - Oct 5 - 6, 2016
DASIP 2016 at Rennes France - Oct 12 - 14, 2016
DownStream: Solutions for Post Processing PCB Designs
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TrueCircuits: UltraPLL

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