New Solutions Offer Customers Size, Performance and Integration Advantages
HILLSBORO, Ore. & BARCELONA, Spain — (BUSINESS WIRE) — February 8, 2010 — TriQuint Semiconductor, Inc (NASDAQ: TQNT), a leading RF front-end product manufacturer and foundry services provider, today unveiled a new RF front-end solution optimized to support recently released 3G chipset solutions from Qualcomm*. The new solution includes the TRITON PA Module™ family for WCDMA and the TQM7M5013, a HADRON II PA Module™ for GSM/EDGE. This solution is highly efficient, optimized for superior current consumption and available in the industry’s smallest footprint using discrete components. It is ideal for the rapidly expanding mobile devices market including data cards, netbooks, e-readers and next generation smartphones.
The introduction of this WEDGE portfolio combines TriQuint’s highly optimized WCDMA and GSM/EDGE products. “We are building on our leadership in the EDGE PAM market and our experience delivering products to the fastest growing segments of the market -- smartphones, data cards and other mobile internet devices (MIDs). The market for discrete WCDMA amplifiers, driven by the increasing number of frequency bands per wireless device, represents a significant opportunity for market share expansion,” said Tim Dunn, Vice President of Mobile Devices at TriQuint. “TriQuint has worked hard to optimize our technology to offer a highly competitive, complete RF front-end solution for all of the industry’s leading 3G chipset providers. Lead customers are pleased with the performance of the products and the integration roadmap. We anticipate strong market adoption for these products ramping in the second half of 2010.”
The new TRITON PA Module family of 3x3mm discrete Power Amplifier Modules covers all major 3GPP WCDMA bands and is capable of multi-mode operation. The TRITON products provide superior current consumption and thermal performance, critical for today’s feature-rich smartphones and wireless devices. TriQuint designed the TRITON family for performance, size and efficiency by leveraging a combination of its proprietary and innovative technologies, Copper Flip, CuFlip™ and TQBiHEMT. CuFlip enables superior RF performance and design flexibility while speeding manufacturing and assembly. TQBiHEMT enables the integration of two gallium arsenide (GaAs) processes onto a single die, reducing part count and saving board space. Together, these processes enable TriQuint to deliver an integrated feature set using a single die inside the module; all other market solutions require multiple die and/or complex assembly processes.
The TQM7M5013, a 5x5mm quad-band, HADRON II PA Module provides the GSM/EDGE portion of the WEDGE solution when paired with the TRITON modules. It incorporates an innovative architecture, enabling improved efficiency and resulting in longer talk time for consumers. The TQM7M5013 provides the building blocks for future converged/multi-mode amplifiers. Aligned with a recently released 3G Qualcomm chipset, the TQM7M5013 is highly versatile and designed into more than a dozen platforms that are expected to launch in 2010. The TQM7M5013 builds on the success of the previous generation HADRON, the TQM7M5012, which enjoys more than 50 percent1 of today’s global market share for EDGE-Polar PAs.
WCMDA is the fastest growing communications standard. According to Qualcomm’s Quarterly Regional CDMA Based Device Shipment Estimates2, WCDMA experienced 17% growth from 2008-2009 and is expected to grow 28% from 2009 to 2010 based on midpoint 2010 guidance.
* Other names property of respective companies.
1:TriQuint internal estimates
2: Regional CDMA-Based Device Shipment Estimates
FORWARD LOOKING STATEMENTS
This TriQuint Semiconductor, Inc (NASDAQ: TQNT) press release contains forward-looking statements made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Readers are cautioned that forward-looking statements involve risks and uncertainties. The cautionary statements made in this press release should be read as being applicable to all related statements wherever they appear. Statements containing such words as ‘optimized’, ‘superior’, ‘smallest’, ‘ideal’, world-class’, ‘easily’, ‘impressed’ or similar terms are considered to contain uncertainty and are forward-looking statements. A number of factors affect TriQuint’s operating results and could cause its actual future results to differ materially from any results indicated in this press release or in any other forward-looking statements made by, or on behalf of, TriQuint including, but not limited to: those associated with the unpredictability and volatility of customer acceptance of and demand for our products and technologies, the ability of our production facilities and those of our vendors to meet demand, the ability of our production facilities and those of our vendors to produce products with yields sufficient to maintain profitability, as well as the other “Risk Factors” set forth in TriQuint’s most recent 10-Q report filed with the Securities and Exchange Commission. This and other reports can be found on the SEC web site, www.sec.gov. A reader of this release should understand that these and other risks could cause actual results to differ materially from expectations expressed / implied in forward-looking statements.
FACTS ABOUT TRIQUINT
Founded in 1985, we “Connect the Digital World to the Global Network”® by supplying high-performance RF modules, components and foundry services to the world's leading communications companies. Specifically, TriQuint supplies products in the top five mobile phone manufacturers, and is a leading gallium arsenide (GaAs) supplier to major defense and space contractors. TriQuint creates standard and custom products using advanced processes that include gallium arsenide, gallium nitride (GaN), surface acoustic wave (SAW) and bulk acoustic wave (BAW) technologies to serve diverse markets including wireless handsets, laptops, GPS/PND, base stations, broadband communications and military. TriQuint is also the lead researcher in a multi-year DARPA program to develop advanced GaN amplifiers. TriQuint, as named by Strategy Analytics1, is the number-three worldwide leader in GaAs devices and the world’s largest commercial GaAs foundry. TriQuint has ISO9001 certified manufacturing facilities in Oregon, Texas, and Florida and a production plant in Costa Rica; design centers are located in North America and Germany. Visit TriQuint at www.triquint.com/rf to receive new product information and to register for our newsletters.
1 Announced February 2009 and May 2009, respectively.
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TriQuint Semiconductor, Inc
Shane Smith
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Mobile Devices
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Mobile: +1-407-489-5291
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Kevin
Schoenrock
Product Marketing Manager
+1-407-884-3452
Mobile:
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Shannon
Rudd
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