SMSC Introduces Industry’s First High-Speed USB Interconnect Device (HSIC) for Embedded Applications
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SMSC Introduces Industry’s First High-Speed USB Interconnect Device (HSIC) for Embedded Applications

HAUPPAUGE, N.Y. — (BUSINESS WIRE) — May 26, 2009 SMSC (NASDAQ: SMSC), a leading semiconductor company providing innovative connectivity solutions spanning analog, digital and mixed-signal technologies, today announced the industry’s first Hub and Flash Media Card Reader Combo solution with a High-Speed Inter-Chip (HSIC) interface – SMSC’s USB4640. The single-package, dual function USB4640 offers USB port expansion and flash media card reader access to users by connecting to an SoC host port using the new High-Speed Inter-Chip USB Electrical Specification Version 1.0 interface. In addition to reducing the complexity of the SoC and system power consumption, this solution offers a versatile, cost-effective means to reduce bill of materials costs and footprint by integrating USB hub and card reader functions in a single chip.

HSIC is a newly introduced USB standard. It is a 2-wire digital bus that enables the use of USB protocol as a low-power, chip-to-chip interconnect, while taking advantage of the broad availability of existing USB drivers and software. This interface reduces power consumption and eliminates analog circuitry from the SoC and USB upstream port. Target applications include digital TVs, printers, PCs, portable CE, gaming consoles and embedded systems.

Footprint and Power Consumption Advantages

“This new HSIC-based USB and Flash Media controller combo solution is designed to enable virtually seamless integration of low power USB connectivity with embedded Flash media for system designs requiring additional connectivity ports,” said Mark Bode, Vice President of Connectivity Marketing at SMSC. “By combining full-featured components into one device, SMSC is able to deliver high-performance data transfer, while using HSIC to deliver significant improvement in power efficiency – up to 20 percent.”

"The USB 2.0 Promoter Group released the HSIC specification to promote the use of USB as a chip-to-chip communication interface," said Jeff Ravencraft, Chairman and President of the USB-IF. “SMSC's support in developing standard-based HSIC solutions will help to build an ecosystem for this interface that allows OEMs to build products that capitalize on the ubiquity of USB software.”

The SMSC USB4640 is available in a 48-pin QFN (7x7mm) lead-free, RoHS-compliant package. It is also available as an industrial temperature qualified device supporting -40° to 85° Celsius, thus enabling improved thermal characteristics that are required for many embedded applications.

Pricing & Availability:

Product samples of the USB4640 are available today. Production quantities can be purchased at a price of $2.50 per unit in 1K quantities.

About SMSC:

Many of the world’s most successful global technology companies rely upon SMSC as a go-to resource for semiconductor system solutions that span analog, digital and mixed-signal technologies. Leveraging substantial intellectual property, integration expertise and a comprehensive global infrastructure, SMSC solves design challenges and delivers performance, space, cost and time-to-market advantages to its customers. SMSC’s application focus targets key vertical markets including consumer electronics, automotive infotainment, PC and industrial applications. The Company has developed leadership positions in its select markets by providing application specific solutions such as mixed-signal embedded controllers, non-PCI Ethernet, ARCNET, MOST® and Hi-Speed USB.

SMSC is headquartered in Hauppauge, New York with operations in North America, Asia and Europe. Engineering design centers are located in Arizona, New York, Texas and Karlsruhe, Germany. Additional information is available at www.smsc.com.

Forward Looking Statements:

Except for historical information contained herein, the matters discussed in this announcement are forward-looking statements about expected future events and financial and operating results that involve risks and uncertainties. These uncertainties may cause our actual future results to be materially different from those discussed in forward-looking statements. Our risks and uncertainties include the timely development and market acceptance of new products; the impact of competitive products and pricing; our ability to procure capacity from our suppliers and the timely performance of their obligations, commodity prices, interest rates and foreign exchange, potential investment losses as a result of liquidity conditions, the effects of changing economic and political conditions in the market domestically and internationally and on our customers; our relationships with and dependence on customers and growth rates in the personal computer, consumer electronics and embedded and automotive markets and within our sales channel; changes in customer order patterns, including order cancellations or reduced bookings; the effects of tariff, import and currency regulation; potential or actual litigation; and excess or obsolete inventory and variations in inventory valuation, among others. In addition, SMSC competes in the semiconductor industry, which has historically been characterized by intense competition, rapid technological change, cyclical market patterns, price erosion and periods of mismatched supply and demand.

Our forward looking statements are qualified in their entirety by the inherent risks and uncertainties surrounding future expectations and may not reflect the potential impact of any future acquisitions, mergers or divestitures. All forward-looking statements speak only as of the date hereof and are based upon the information available to SMSC at this time. Such statements are subject to change, and the Company does not undertake to update such statements, except to the extent required under applicable law and regulation. These and other risks and uncertainties, including potential liability resulting from pending or future litigation, are detailed from time to time in the Company's reports filed with the SEC. Investors are advised to read the Company's Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the Securities and Exchange Commission, particularly those sections entitled “Other Factors That May Affect Future Operating Results” or “Risk Factors” for a more complete discussion of these and other risks and uncertainties.

SMSC and MOST are registered trademarks of Standard Microsystems Corporation. Product names and company names are trademarks of their respective holders.



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