June 23, 2008 -- IMEC 3D integration workshop - A unique forum to debate on 3D integration issues, technological options, standards & conventions and roadmaps.

When: November 13 -14, 2008 - Hsinchu - Taiwan

Where: Ambassador Hotel, 11th Floor - Ballroom D, 11th Floor - 188 Chung Hwa Road, Section 2 - Hsinchu, Taiwan. Telephone: (886) 3 515 1111

About the Event:
The aim of this 3D integration workshop is to confront different views and initiate and stimulate the route towards standardizations in 3D.

IC manufacturers and research groups are scrambling for a part of the 3D integration action. The first appliances with 3D chips are already available, with many more to come. But there are still a lot of questions surrounding 3D. Will 3D be limited to niche applications or will it become a widespread technology? Will 3D be cost-effective? What is the roadmap for 3D, and which of the many technical options will be used? How can 3D systems be tested? What are the requirements for the supply chain? This event will address these and other questions.

Who should attend?
The entire 3D supply chain: IC manufacturers, the fabless community, tools and equipment suppliers, material suppliers, packaging and test houses and EDA suppliers.

Format:
Each session will start with a presentation of the consolidate view of major 3D players on key 3D technology topics, followed by an interactive discussion.

Host:
Organized by IMEC, Europe's leading independent nanoelectronics research center and IMEC Taiwan.

Register now at www.imec.be/3Dworkshop

PROGRAM
November 13, 2008
08:30-09:00 Registration and coffee
09:00-10:30 3D integration roadmap, classifications and standardization needs
10:30-11:00 Coffee break
11:00-12:30 3D design and cost-effectiveness
12:30-13:30 Lunch
13:30-15:00 3D Technology session 1: Thin die and thin wafer handling, stacking and bonding approaches
15:00-15:30 Coffee break
15:30-17:00 Test: Known-good die, in-process inspection, final test
18:00-21:00 Dinner in Prego Italian Restaurant, 9th floor, Ambassador hotel
November 14, 2008
08:00-09:30 3D Technology session 2: Through-silicon via processes
09:30-09:50 Coffee break
09:50-11:10 3D Technology session 3: Package integration of 3D stacks
11:10-11:30 Coffee break
11:30-13:00 Supply chain and standardization
13:00-14:00 Lunch

LODGING ACCOMMODATIONS
A block of rooms has been reserved at a special rate of NTD 4,650 +10 percent per night, breakfast included. Check-in November 12 and check-out November 14.
Rooms can be reserved by completing the following form at http://www.ambh.com.tw/en/hsinchu/reservation/room-reservation.aspx Please mention the hotel booking code 241724 to get the special rate.

REGISTRATION
FEES (VAT included) Early bird registration before September 30, 2008 is 7000 NTD (USD225) for the two-day workshop. Dinner registration before September 30, is 1500 NTD (USD50).

Registration for the two-day workshop after October 1, 2008 is 8800 NTD (USD285). Dinner reservations after that date are 1500 NTD (USD50).

Contact:

Registration:

Mrs. Inge Struys,
Event Manager IMEC,
T: +32 16 288 980,
Fax: +32 16 28 16 37
E-mail: Email Contact

Media:

Barbara Kalkis,
Maestro Marketing & PR,
T : +1 408 996 9975,
Email Contact

Local Taiwan enquiries:

Prof. Tien-Fu Lei,
IMEC Taiwan,
T :+886-3-5781115
E-mail: Email Contact