New CMOS Image Sensor Provides High-End Camera Phone Users With Great Visual Experience, Even in Low-Light Conditions
"With the launch of our new 2-megapixel ET8EA3-AS CMOS image sensor, Toshiba can support the higher-resolution camera requirements of cell phone manufacturers," said Andrew Burt, director of the Wireless Business Unit at TAEC. "We believe camera phones will start to compete effectively with low- end digital still cameras at the 2-megapixel level. We expect our new device will accelerate that trend and reinforce Toshiba's CMOS imaging leadership." He noted that Toshiba CMOS image sensors have proven their superiority in image quality comparisons by offering demonstrably better color balance and picture quality, even in dark-light conditions.
Key Features
The ET8EA3-AS CMOS image sensor is an area color image sensor that incorporates an A/D converter in non-diced wafer form; key features include the following:
* Adoption of a square pixel, each 3.3 x 3.3um, achieves approximately 2 megapixels of array resolution in a 1632 horizontal by 1216 vertical array with a 1/2.7-inch optical format * Capable of up to 15 frame-per-second (fps) operation for full-resolution output * Achieves low-power consumption engendered by Toshiba's renowned CMOS process technology * Toshiba's advanced sensor technology and sophisticated signal processing technology result in excellent picture quality * Can use with a companion Toshiba DSP chip that provides YUV or JPEG encoded data or employ another suitable external DSP chip Toshiba CMOS Image Sensor Product Line
Cell phones, including the new Smartphones, increasingly incorporate built-in video- and still-image capabilities. CMOS image sensors are widely used in such products as they enjoy advantages in small size and low-power consumption compared to CCDs. Toshiba's CMOS image sensors employ a special square pixel design that enables them to achieve CCD-quality images with low-power consumption, even in low-light conditions. Recognized for its excellence in CMOS imaging, Toshiba currently offers the TCM8230MD VGA camera module, the TCM8240MD 1.31-megapixel camera module and the new ET8EA3-AS 2-megapixel CMOS image sensor chip. 3.2-megapixel chips are under development at Toshiba.
Pricing and Availability
Samples of the ET8EA3-AS are currently available with mass production planned for June, 2005. Pricing is $25.00 each in 10,000-piece quantities.
Technical Specification Summary Part Number ET8EA3-AS Optical Format 1/2.7 inch Output Pixel 1632 (H) x 1216 (V) Numbers Pixel Size Square pixel: 3.3um (H) x 3.3um (V) Image Size 5.386mm (H) x 4.013mm (V) Scanning Progressive-scanning Color Filter RGB primary color filter, Bayer arrangement Output Data RAW data, 12-bit parallel External Clock 6 to 20MHz, including phase-locked loop Frequency Range Frame Rate 15 frames per second (fps)/7.5fps @ UXGA output 30fps/15fps/7.5fps @ SVGA output Interface Control I(2)C bus Power Supply 2.8 +/- 0.2 Volts (V) or 1.5 +/- 0.1V Power Consumption 2.8V: 20mA (typical) at 30fps 1.5V: 60mA (typical) at 30fps Operating -20 degrees - 60 degrees C Temperature Functionality Automatic blemish detection and correction, lens shading compensation, variable electronic shutter, variable gain control, built-in feedback clamp Package Non-diced wafer *About TAEC
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes semiconductors, flash memory-based storage solutions, and displays for the computing, wireless, networking, automotive and digital consumer markets.
TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, one of the five largest semiconductor companies worldwide in terms of global sales for the year 2003 according to Gartner/Dataquest's Worldwide Semiconductor Market Share Ranking. Toshiba is a world leader in high-technology products with more than 300 major subsidiaries and affiliates worldwide. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Email Contact.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.chips.toshiba.com/, or from your TAEC representative.
All trademarks and tradenames used herein are the properties of their respective holders.
CONTACT: Judy Kahn, +1-650-948-8881,
Email Contact, for TAEC;
or Deborah Chalmers of Toshiba America Electronic Components, Inc.,
+1-408-526-2454,
Email Contact
Web site: http://www.toshiba.com/taec
Web site: http://www.chips.toshiba.com/