"Smart Digital Control is an important step forward for LED lighting, opening new possibilities as we introduce optimized algorithms for very high performance levels while reducing system costs," said Stephane Curral, vice president and general manager, power and lighting solutions business line, NXP Semiconductors. "By offering a digital core within a traditional analog system, we're making it easy for engineers to fine-tune and achieve the right balance between efficiency, current regulation and system cost for their specific LED designs -- with more flexibility compared to pure analog solutions."
The SSL21101 is a single-stage solution designed to drive LED devices in flyback or buck-boost configurations with very high efficiency -- up to 90% depending on the application -- and with highly accurate control of the output current. In the SSL21101, the Smart Digital Control feature offers two modes optimized for specific regional regulatory requirements. In High Power Factor mode, the PF rating is higher than 0.95 and the total harmonic distortion (THD) is limited to under 20%. The Low Ripple mode lowers the LED current ripple below 1% and makes it possible to use smaller electrolytic capacitors, enabling very compact designs.
Featuring a high level of integration and functionality in a small footprint, the SSL21101 includes a high-voltage power switch as well as a circuit that enables start-up directly from the rectified mains voltage, and is equipped with a complete set of protections. The SSL21101 enables finished applications using as few as 18 components, resulting in a very low bill of materials -- in high volume, less than US $1.30 for a complete system eBOM excluding LEDs. Additional product information is available at: http://www.nxp.com/pip/SSL21101T
Features
- Non-dimmable LED driver powering up to 15W from 100V to 230V (universal mains)
- Smart Digital Control with two modes: High Power Factor ( > 0.95) and Low Ripple ( < 1%)
- Integrated 700V MOSFET
- Efficiency of up to 90% depending on the application
- Primary side sensing (no optocoupler required)
- True current source behavior, independent of mains voltage, LED voltage, temperature and coil variations
- Better than 3% current accuracy
- Extensive set of internal protections, including short-winding protection, internal over-temperature protection (OTP), LED short protection, LED open protection, and undervoltage lockout protection (UVLO)
- NTC input pin to limit the maximum LED temperature
- SO14 package
Availability
The GreenChip SSL21101 driver IC for high-performance non-dimmable LED applications is now in volume production. Additional GreenChip SDC products addressing high-performance dimmable LED applications are currently under development.
Links
- NXP SSL21101 product information: http://www.nxp.com/pip/SSL21101T
- SSL21101 leaflet: http://www.nxp.com/documents/leaflet/75017279.pdf
- SSL21101 data sheet: http://www.nxp.com/documents/data_sheet/SSL21101T.pdf
- GreenChip SSL products from NXP: http://www.nxp.com/greenchip/ssl
About NXP Semiconductors
NXP Semiconductors N.V. (
Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website,
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