With multiple system design scenarios such as system-in-package, system-on-chip, mixed-signal design integration, hybrid substrates, 3D integrated ICs, and multicore multiprocessors, the pressure on robust package electrical design is increasing exponentially. There is a significant need for crosstalk control, co-simulation, and incremental design enhancement in a variety of design methodologies while ensuring accurate simulation of full-wave electromagnetic effects. At the same time, the need to efficiently and accurately analyze and optimize the chip-package-board environment is critical for developing cost-efficient systems. This panel brings together experts in design and simulation of ICs and packages to discuss the interactions between the two domains and the needed enhancement in electronic design automation solutions.
WHAT: Package Extraction, Modeling, and Simulation in IC-
Packaging-Board Design
WHERE: DesignCon 2008, Santa Clara Convention Center, Santa
Clara, California
WHEN: Wednesday, February 6, 2008, 3:45 p.m. - 5:00 p.m.
WHO: Chair: Dr. Vikram Jandhyala, CEO & Founder, Physware, Inc.
Dr. Bruce Archambeault, Distinguished Engineer, IBM
Dr. Rajen Murugan, Signal Integrity Engineer, Texas
Instruments
Dr. Judy Priest, Principal Engineer and SI Manager, Cisco
Systems
Dr. Kaladhar Radhakrishnan, Manager, Power Delivery Team,
Intel Corporation
Dr. Andrew Yang, Co-Founder & CEO, Apache Design Solutions
In addition, Dr. Jandhyala will also conduct a tutorial session at the conference titled "Computational Electromagnetics: From Maxwell's Equations to Signal Integrity and System Design." This tutorial focuses on the fundamentals of Maxwell's equation solutions, and state-of-the-art applications to signal integrity and microelectronics design.
WHAT: Computational Electromagnetics: From Maxwell's Equations to
Signal Integrity and System Design
WHERE: DesignCon 2008, Santa Clara Convention Center, Santa Clara,
California
WHEN: Monday, February 4, 2008, 9:00 a.m. - noon
For additional information on the panel and the tutorial, visit http://www.designcon.com/2008/conference/tec_panel_wednesday_package. html (Due to its length, this URL may need to be copied/pasted into your Internet browser's address field. Remove the extra space if one exists.)
http://www.designcon.com/2008/conference/tf_ma4.html
About Physware
Physware, Inc. develops high-speed field solutions for signal and power issues in high-frequency package and board-level electrical modeling and design for the microelectronics industry. The company's patent-pending, physics-aware technology tightly couples analysis and design methods to the underlying Maxwell's and circuit equations, enabling robustness and efficiency at every step of the design cycle and significantly reducing time to market. Physware's accelerated technology delivers unprecedented capacity, handling in package and board simulations, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy.
Physware is a venture-backed, privately held company led by an experienced management and advisory team. The technology is based on multiple patent-pending methodologies, over one hundred publications and several Ph.D. theses. For additional information, please visit www.physware.com.
Contact:
Physware, Inc.
Bala Vishwanath, 425-458-0597
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